January February 2023
Volume 27, Number 1
Recently, through-silicon via (TSV) technologies have been widely used in high-bandwidth memory for high-performance computing or high-density memory modules. For mobile memory packaging, conventional wire bonding is still being used, due in part to cost considerations. As overall mobile memory system performance is improved, however, there is a need for a thinner package that has better thermal and electrical performance. Inside this latest issue of CSR, the Hynix Integrated Fanout Memory (HIFOM) is described—it’s a chip stackable fan-out wafer-level package that offers better performance than conventional wire-bonded type memory packages.
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Cover image courtesy of iStock/Sunshine Seeds
March April 2023
Volume 27, Number 2
In response to a decade of slowing of Moore’s Law, the semiconductor industry has embraced advanced packaging with 2.5D and 3D platforms to address market demand. Advances in packaging are leading the way to innovate product roadmaps. At the center of revolutionary products today is hybrid bonding, which is expected to become more pervasive in the chiplet era.
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Cover image and feature article entitled 3D chiplet integration with hybrid bonding is contributed by Adeia
May June 2023
Volume 27, Number 3
The drivers of semiconductor packaging technologies include meeting the packaging performance requirements for applications related to artificial intelligence (AI) processors, high-performance computing (HPC) and high-bandwidth memory (HBM), datacenter devices, network processors, and virtual reality devices. Related to the demand for AI and HPC are supply chain issues for advanced IC substrates. Articles in this issue offer solutions to some of these challenges
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Cover image courtesy of iStockphoto/jiefeng jiang
July August 2023
Volume 27, Number 4
Advanced packaging technologies fuel today’s most exciting new applications, but are limited in I/O density, bandwidth, and scale. Novel trends toward adaptable directwrite lithography are emerging to enable a new generation of leading-edge advanced packaging, yielding more connectivity, higher density, and faster speeds between chips.
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Cover image courtesy of Multibeam Corporation
September October 2023
Volume 27, Number 5
New semiconductor materials, alternative pad designs, and ever-shrinking geometries are raising the complexity and the cost of wafer test, posing tough challenges—especially on the probing side. These trends are driving the need for innovative test techniques able to increase capacity and control capital equipment cost. A new approach to wafer testing, based on flying probe technology, has been introduced in order to allow manufacturers to increase test efficiency, thereby minimizing the cost per die.
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Cover image courtesy of SPEA S.p.A.
November December 2023
Volume 27, Number 6
Legislation to support reduction in carbon dioxide emissions is driving the growth in the electric vehicle (EV) market. LiDAR is also driving trends in automotive photonics devices. This issue features two articles that cover these important needs. MRSI (a part of Mycronic Group) discusses the photonics device assembly requirements and trends in automotive LiDAR and presents a solution for typical edge-emitting lasers and VCSEL chips. To answer the need for on-board systems such as EV traction inverters, DC/DC converters, etc., which must be connected to highvoltage power sources, NXP Semiconductors, Inc., presents a package designed for automotive highvoltage gate driver applications.
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Cover image courtesy of iStock/Just_Super
