January February 2024
Volume 28, Number 1
The megachip approach helps to rearchitect heterogeneous chip tiling for developing highly complex systems having desired circuit density and performance. Recent work on large-area superconducting integrated circuits to join multiple individual die is highlighted in this article, with particular attention paid to the processing of the high-density electrical interconnects formed between the individual die.
Cover image courtesy of iStock/NiPilot
March April 2024
Volume 28, Number 2
Semiconductors are the foundation for artificial intelligence (AI), quantum computing, Internet of Things (IoT), and advanced wireless communications, notably 5G. Due to Moore’s Law reaching its limit, and the system-on-chip (SoC) platform showing its shortcomings, advanced packaging has become a critical area for development to enable continuous performance improvement at reasonable cost. Glass-based advanced packaging and novel device architectures can play an important role.
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Photo courtesy of Corning Incorporated
