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July 23, 2026July 23, 2026 | Tempe, AZ | Amkor Technology, Inc. today announced a multi-year strategic partnership with NVIDIA to develop advanced semiconductor packaging and test… […] Read more…
April 28, 2026Tokyo, Japan | Resonac Corporation | April 20, 2026 | Resonac Launches R&D Center for Next-Gen Semiconductor Package Technology under U.S.-Japanese Consortium “US-JOINT” Public and… […] Read more…
January 30, 2026FAMES pilot line inaugurated after delivering first validated technical results New cleanroom Is a world-class facility that will host state-of-the-art 300mm semiconductor equipment Grenoble, France… […] Read more…
September 25, 2025Plano, Texas, USA – September 24, 2025 | Today at the 2025 TSMC North America Open Innovation Platform® (OIP) Ecosystem Forum, Siemens Digital Industries Software… […] Read more…
June 19, 2025Applied Materials and CEA-Leti Expand Joint Lab To Drive Innovation in Specialty Chips Based at CEA-Leti, collaboration focuses on materials engineering solutions To enable more… […] Read more…
April 8, 2025March 10, 2025 | Teradyne to acquire Quantifi Photonics to deliver photonic IC testing to the high-performance Compute market NORTH READING, Mass.–(BUSINESS WIRE)– Teradyne, Inc.… […] Read more…
February 3, 2025TOKYO, January 10, 2025—Canon Inc. announced today that the company has been honored with a 2024 Excellent Performance Award, presented by leading global semiconductor foundry… […] Read more…
November 21, 2024ASU and Deca Technologies selected to lead $100M SHIELD USA project to strengthen U.S. semiconductor packaging capabilities TEMPE, AZ-USA | November 21, 2024 – The… […] Read more…
September 4, 2024Wilmington, MA -(BUSINESS WIRE)-September 4, 2024 -Onto Innovation Inc. (NYSE: ONTO) announced the opening of the company’s Packaging Applications Center of Excellence (PACE), a first-of-its-kind… […] Read more…
August 5, 2024Singapore and Armonk, New York, July 24, 2024 — ASMPT and IBM today announced a renewed agreement to extend their collaboration on the joint development… […] Read more…
August 5, 2024Resonac announces new US-JOINT consortium; ten partners to collaborate on Next-generation semiconductor packaging in Silicon Valley The consortium will help to further advance technology in… […] Read more…
June 4, 2024In response to growing customer demand, the Siemens Xcelerator as a Service portfolio will become available on Microsoft Azure, beginning with Siemens’ Teamcenter X software… […] Read more…
February 1, 2024Partnership to strengthen European automotive supply chain and expand services for global customers Tempe, AZ, USA – January 16, 2024 — Amkor Technology, Inc. (Nasdaq:… […] Read more…

Product News

July 23, 2026San Francisco and Sunnyvale, CA USA — July 23, 2026, |AMD (NASDAQ: AMD) and Cerebras Systems (NASDAQ: CBRS) announced a technical partnership to deliver a new… […] Read more…
April 28, 2026Plano, Texas, USA – April 22 2026 | Siemens collaborates with TSMC to advance AI for semiconductor design. Siemens collaborates with TSMC to advance AI-powered… […] Read more…
January 30, 2026MRSI Mycronic is proud to announce the launch of the MRSI-LEAP high-speed 1µm die bonder. This innovative equipment is designed for ultra-high-volume manufacturing of optical… […] Read more…
November 4, 2025Sunnyvale, CA USA, Nov 04, 2025 – Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today… […] Read more…
September 25, 2025The collaboration provides customers with a modular, memory-centric foundation for advanced multi-die architectures Chandler, AZ. and San Jose, CA., Sept. 10, 2025 (GLOBE NEWSWIRE) — As… […] Read more…
August 4, 2025NORTH READING, Mass.–(BUSINESS WIRE)– Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, is proud to announce the launch of… […] Read more…
June 19, 2025Marvell Develops Industry’s First 2nm Custom SRAM for Next-Generation AI Infrastructure Silicon Industry’s highest bandwidth per sq mm with up to 6 gigabits of high-speed… […] Read more…
April 8, 2025ficonTEC reveals an innovative 300 mm double-sided electro-optical wafer tester compatible with existing ATE and targeted at AI-driven silicon photonics March, 2025 | ficonTEC Service… […] Read more…
April 8, 2025TOKYO / MARCH 27, 2025 — Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi Iwade; hereinafter “Toray Engineering”) has developed the… […] Read more…
November 21, 2024Smiths Interconnect’s DaVinci 112 High-Speed Test Socket Wins Best Test Measurement Award at the 2024 Global Electronics Achievement Awards Shenzhen,  China – November 5, 2024… […] Read more…

Event News

August 3, 2026Boston, MA USA – September 28 – October 1, 2026 The 59th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging… […] Read more…
August 3, 2026The 11th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2026) is the premier international event in the field of electronics packaging and system integration. The… […] Read more…
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Featured Articles

September 17, 2024Featured Article / LithographyBusinesses and consumers are adopting artificial intelligence (AI) at a rapid pace, placing enormous new demands on computing and communications. Next-generation data centers supporting upcoming… […] Read more…
February 2, 2024Featured Article / Heterogeneous IntegrationBy Rabindra N. Das, Jason Plant, Alex Wynn, Matthew Ricci, Ryan Johnson, Matthew Stamplis, et al. [MIT Lincoln Laboratory] Chip Scale Review January • February… […] Read more…
May 31, 2022Featured ArticleLarge-size multi-layered fan-out RDL multi-chip module packaging By Nicholas Kao, Jay Li, Jackson Li, Yu-Po Wang[Siliconware Precision Industries Co., Ltd] This article was published in… […] Read more…
March 30, 2022Featured ArticleSince the invention of metaloxide-semiconductor(MOS) integrated circuits in the early 1960s, the speed, capacity, and complexity of the chips have increased dramatically, roughly following Moore’s… […] Read more…
Well-designed examples do more than illustrate a definition: they show how an idea behaves under realistic conditions. In technical writing, a strong example states its assumptions, inputs, and expected result, helping readers distinguish a general rule from a special case. A test case with explicit values and acceptance criteria makes the link between theory and practice clear, while edge cases show where the rule stops applying. Good examples also vary in difficulty, moving from a familiar scenario to a less obvious application without changing the underlying principle. Tables, diagrams, and brief annotations can clarify comparisons, but they should support the explanation rather than replace it. The most effective examples remain concise, verifiable, and close to the reader’s task, encouraging accurate application rather than passive recall.