In hybrid bonding, tight alignment and overlay accuracy between the wafers is required to achieve good electrical contact between the interconnected devices on the bonded wafers. Constant reduction in pitches is fueling tighter bonding specifications. Shown here is the SmartView® NT3 Aligner, which achieves sub-50nm alignment accuracy on 300 mm wafers, supporting advanced 3D applications such as memory and logic stacking, AI accelerators, and heterogeneous integration.
Cover image courtesy of EV Group