Industry News
November 21, 2024ASU and Deca Technologies selected to lead $100M SHIELD USA project to strengthen U.S. semiconductor packaging capabilities TEMPE, AZ-USA | November 21, 2024 – The… […]
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September 4, 2024Wilmington, MA -(BUSINESS WIRE)-September 4, 2024 -Onto Innovation Inc. (NYSE: ONTO) announced the opening of the company’s Packaging Applications Center of Excellence (PACE), a first-of-its-kind… […]
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August 5, 2024Singapore and Armonk, New York, July 24, 2024 — ASMPT and IBM today announced a renewed agreement to extend their collaboration on the joint development… […]
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August 5, 2024Resonac announces new US-JOINT consortium; ten partners to collaborate on Next-generation semiconductor packaging in Silicon Valley The consortium will help to further advance technology in… […]
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June 4, 2024In response to growing customer demand, the Siemens Xcelerator as a Service portfolio will become available on Microsoft Azure, beginning with Siemens’ Teamcenter X software… […]
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February 1, 2024Partnership to strengthen European automotive supply chain and expand services for global customers Tempe, AZ, USA – January 16, 2024 — Amkor Technology, Inc. (Nasdaq:… […]
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Product News
November 21, 2024Smiths Interconnect’s DaVinci 112 High-Speed Test Socket Wins Best Test Measurement Award at the 2024 Global Electronics Achievement Awards Shenzhen, China – November 5, 2024… […]
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August 5, 2024August 5, 2024 – Tewksbury, MA, USA: MRSI Systems The optical components industry demands highly precise and customized equipment for complex optical assembly processes. We… […]
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June 4, 2024Dedicated HVM equipment platform boosts productivity and lowers cost-of-ownership of novel infrared laser release technology through silicon carrier wafers for 3D integration applications ST. FLORIAN,… […]
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June 4, 2024SUNNYVALE, Calif., May 29, 2024 – Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced… […]
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March 27, 2024Tokyo, Japan, March 15, 2024 – Toray Industries, Inc., announced today that it has developed an insulating resin material for hybrid bonding (micro bonding). The… […]
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February 1, 2024Hayward, CA, USA – Gel-Pak, a Delphon company and a global leader in elastomer-based materials and protective carriers for the semiconductor, medical, and electronics industries,… […]
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Event News
November 21, 202470th Annual IEEE International Electron Devices (IEDM) Meeting Shaping Tomorrow’s Semiconductor Technology San Francisco, CA – USA December 7-11, 2024 IEEE International Electron Devices Meeting… […]
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October 16, 2024The 26th Electronics Packaging Technology Conference will be held December 3rd – 6th 2024. The conference will be at the Grand Copthorne Waterfront Hotel, Singapore… […]
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Featured Articles
September 17, 2024Featured Article / LithographyBusinesses and consumers are adopting artificial intelligence (AI) at a rapid pace, placing enormous new demands on computing and communications. Next-generation data centers supporting upcoming… […]
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February 2, 2024Featured Article / Heterogeneous IntegrationBy Rabindra N. Das, Jason Plant, Alex Wynn, Matthew Ricci, Ryan Johnson, Matthew Stamplis, et al. [MIT Lincoln Laboratory] Chip Scale Review January • February… […]
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May 31, 2022Featured ArticleLarge-size multi-layered fan-out RDL multi-chip module packaging By Nicholas Kao, Jay Li, Jackson Li, Yu-Po Wang[Siliconware Precision Industries Co., Ltd] This article was published in… […]
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March 30, 2022Featured ArticleSince the invention of metaloxide-semiconductor(MOS) integrated circuits in the early 1960s, the speed, capacity, and complexity of the chips have increased dramatically, roughly following Moore’s… […]
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