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Figure 7: Application idea of SELFA to CoW and FOWLP processes.
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“Die-to-wafer (D2W) processing Laugier, E. Rolland, B. Montmayeul, IlBok Lee, InSu Mok, WonChul Do,
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advanced node logic,” 2019 IEEE for 3D die-to-wafer using direct ultra-thin, high-f lexibility 3D
69th ECTC, pp. 600-606. bonding: A step forward toward FOWLP (3D SWIFT® technology)
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Biographies
Taro Shiojima is a Material Engineer in the R&D Institute at SEKISUI CHEMICAL CO., LTD., Osaka,
Japan. He engages in the development of materials for 3D packaging applications and holds a Master’s degree
in Material Engineering from the U. of Tokyo, Japan. Email taro.shiojima@sekisui.com
Munehiro Hatai is Chief Manager in the R&D institute at SEKISUI CHEMICAL CO., LTD., Osaka, Japan.
He has been developing semiconductor materials for 20 years and established the basic technology of SELFA.
He holds more than 40 Japanese patents.

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