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of wafer bond strength under controlled MICRO DISPENSING
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61, SF1010, 2022. TECHNOLOGY
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Braithwaite, T. Rogers, “The effect CREATING THEM AS LONG AS WE HAVE.
of atmospheric moisture on crack
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12. K. Baek, J. Kim, M. -s. Han, K. Lim, WE PROVIDE THREE THINGS:
D. M. Rhee, “Chip level evaluation of
wafer-to-wafer direct bonding strength
with bending test,” IEEE 73rd ECTC,
Orlando, FL, USA, 2023, pp. 310-317. Dispensing Expertise in a variety of microelectronic
13. J. Fuse, T. Iwata, S. Ebiko, F. Inoue, packaging applications.
“Robust measurement of bonding
strength for wafer-to-wafer 3D Feasibility Testing & Process Verification based
integration,” International Conf.
on Electronics Packaging (ICEP), on years of product engineering, material flow testing
Kumamoto, Japan, 2023, pp. 105-106. and software control.
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Instrumented indentation and fracture dispensing cartridges, needles, and accessories.
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measurements for thin films on device and electro-mechanical assembly the world over.
substrates,” Acta Materialia 50 (2002): www.dltechnology.com.
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“Measurement of strains at Si-SiO 2 216 River Street, Haverhill, MA 01832 • P: 978.374.6451 • F: 978.372.4889 • info@dltechnology.com
Interface,” J. of Applied Physics 1 May
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Biographies
Junya Fuse received a BS degree in Mechanical Engineering from YOKOHAMA National University, Japan.
He is currently pursuing an MS degree with a focus on chiplets at the same university.
Contact author: Fumihiro Inoue is an Associate Professor at YOKOHAMA National University, Japan. He
worked at imec, specializing in unit processes for 3D integration until 2021. In recognition of his outstanding
contributions to the field, he was awarded the IEEE EPS Outstanding Young Engineer Award for 2022. Email
inoue-fumihiro-ty@ynu.ac.jp

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