Page 21 - ChipScale_Mar-Apr_2020-digital

Besi Enables “More than Moore”

The World Leader in Advanced

Packaging Process Equipment

ThermoCompression Bonding

• Proven HVM TC Bonder

• 8800 TC Next

• Die size up to 70x70 mm

s
m
• 1.5mm, 3s accuracy, theta: 1 mdeg 3s
s
• Inert bonding ambient option

• Superior Tilt Control

Die to Wafer Hybrid Bonding

• 8800 Chameo ultra plus

• Ultra High Accuracy C2W Bonder

• Advanced Cleanliness by Design

• Highest Throughput

• 200nm, 3s accuracy
s

• > 2000 CPH

www.besi.com