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For other applications, the antenna could
be an SiP module antenna or a flip-chip
chip-scale package (fcCSP) with package
on package (PoP) antenna. The different
design options include: 1) SiP mmWave
antenna module; 2) partial molding; 3)
passive/filter integration; 4) array antenna
design; and 5) small form factor.

Figure 3: With an AiP design, the antenna is not a separate device, but is integrated in the device package. Shielding
For higher levels of system integration,
a dva nc e d Si P a nd R F sh ield i ng
technologies are employed. RF SiPs can
contain the complete RF to base-band
system functionality with an integrated
antenna and antenna matching circuitry.
The result is a fully-integrated AiP where
all the elements of at least one complete
RF system is included in the format of a
single semiconductor package.
RF shielding techniques include dual-
side mold, conformal shield, compartment
Figure 4: A technology toolbox for integrated antenna includes several different package platforms. shield using laser trench and paste filling
Implementing AiP technology For some cost-sensitive applications, technology, partial molding, selective
The type of integrated antenna or a flip-chip ball grid array (FCBGA) or conformal shielding, and hybrid SiP
specific AiP platform designed into a double-sided ball grid array (DSBGA) are designs. These techniques implement a
specific application involves several two AiP possibilities. Figure 4 illustrates variety of materials including conductive
factors. In addition to the antenna the extensive technology toolbox for lids, cored, coreless and low coefficient of
structures, an AiP package may also integrated antennas. For mobile and thermal expansion (CTE) substrates and
include a power amplifier (PA), low-noise infrastructure applications, the design innovative conformal shielding materials.
amplifier (LNA), switch and transceiver options include: Figure 5 shows key technologies to
integrated circuits (ICs). Depending on implement different shielding techniques.
the frequency range, different platforms • Antenna in substrate; The type of shielding in the AiP
are used for both the antenna and the IC • Antenna module; can have a signif icant impact on
package. The integrated antenna can be • Dual-side die mount packages performance. Figure 6 shows how
mounted on the package, on a substrate, (DSBGA); a SiP with a sputtered conformal
or in a SiP mmWave antenna module. The • Low density fan-out (LDFO) with shield outperforms an unshielded
AiP approach itself can also vary from integrated antenna layer substrate; SiP, thereby substantially improving
package to package. Figure 3 shows an • High-density fan-out (HDFO) with the electromagnetic compatibility/
example of an AiP implemented with a antenna on package; and electromagnetic interference (EMC/
SiP approach. • Antenna on mold. EMI) performance.

Figure 5: A variety of SiP RF shielding techniques address different design requirements.

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