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Semiconductor Advanced Packaging solutions
Electrochemical plating portfolio
Spherolyte Cu Spherolyte Ni
®
®
High speed, pure and reliable Diffusion barrier for pillar
pillar and RDL plating plating
Spherolyte Sn/SnAg Aurolyte Au
®
®
Lead free, pure and uniform Gold plating
soldering
Packaging applications:
FOWLP, WLCSP, flip chip, power ICs, memory, CI
End User markets:
Mobile applications, 5G technologies, IoT, sensors and processors, automotive
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