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Antenna in package (AiP) technology for 5G growth

By Curtis Zwenger, Vik Chaudhry [Amkor Technology, Inc.]
A ntenna in package (AiP)

or anten na on package
(AoP) simplify challenges
associated with mmWave applications
and expedites system design. Today’s AiP
technologies can be implemented through
standard or custom system in package
(SiP) modules. This article provides an
in-depth look at the different AiP options,
shielding, material selection, and best use
cases in emerging 5G applications.

5G applications and projected growth
The driving forces for implementing 5th
generation new radio 5G (NR) or simply
5G technology, include the transmission
of large data rates as well as the need
for more reliable connections, quicker Figure 1: The market for mmWave devices is expected to grow to 1 billion units by 2023. SOURCE: Gartner,
response time (low latency) and better Small cells market status report, December 2018
coverage. In mmWave applications, development and production scaling for In addition to the reduced size required for
signal loss becomes critical and design such applications by leveraging their broad handheld and other small mmWave devices,
challenges increase in complexity. In customer and supply base. AiP provides improved signal integrity with
addition to emerging 5G smartphones, reduced signal attenuation and addresses
other applications that operate at very 5G AiP technology the range and propagation challenges that
high frequencies and demand a small size Instead of separate power amplifiers occur at higher frequencies. Among the
include wearables, small cells, security (PA), low-noise amplifiers (LNA), changes occurring with the transition from
cameras, radar units in autonomous switches, transceivers, filters and a 4G long-term evolution (LTE) to the 6 to
vehicles and numerous Internet of Things discrete antenna, today’s fully-integrated 60GHz of 5G are increased RF switch and
(IoT) appliances. RFFE module is completely achieved with band complexity (from 40 bands x3 carrier
By 2023, over 1 billion mmWave units AiP technology in a SiP. The integration aggregations [CAs] to 50 bands x5 CAs)
will be produced annually according to is accomplished using SiP technologies, and increased antenna design and tuning
Gartner, Inc. market research. With AiP including double-sided assembly, complexity (from 8x8 multiple input and
technology, the antenna is no longer a advanced wafer-level redistribution layers multiple output [MIMO] to 68x4 MIMO).
separate component within the wireless (RDL), passive component integration and To achieve the promised improvements of
device but is integrated in a SiP with sophisticated RF shielding techniques to 5G (see Figure 2), many of the technical
radio frequency (RF) switches, filters provide the most advanced 5G package challenges must be addressed at the package
and amplifiers. According to consulting solutions available today. level.
firm Yole Développement, the total RF
front-end (RFFE) module SiP market is
projected to reach US $5.3 billion by 2023,
representing an 11.3% compound annual
growth rate (CAGR) (Figure 1).
Another market forecast projects the
5G mmWave market to increase tenfold
by 2025 [1]. The supporting base station
and small cell infrastructure will require
a tremendous amount of semiconductor
packaging and system integration support.
Outsourced semiconductor assembly
and test (OSAT) suppliers are typically
best suited to invest in the package
Figure 2: The use of 5G technology provides significant advantages over previous generations. SOURCE: Raconteur

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