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For mmWave applications, the right AiP Aut onomous veh icle . 1) C a r s 5G in the palm of your hand
design provides several essential system will require multiple connectivity There are many package options to
advantages. With AiP technologies, modes for Infotainment, advanced incorporate AiP in next-generation
system designers get: driver-assistance systems (ADAS) designs. For the quickest and easiest
and over-the-air (OTA) updates; 2) implementation, the OSAT’s package or
• A smaller footprint-phased antenna High-bandwidth 5G connection for SiP must have high-volume production
array design to minimize space; infotainment; and 3) Navigation with capacity to support design of next-
• Reduced signal attenuation for 3D images and rich content. generation mmWave products.
mmWave products; With many of the discussed packages
• Lower power consumption; AiP design services/design already in production, we have been
• Improved range for devices; and capabilities supporting 5G mmWave AiP applications
• A design proven and qualified by Addressing all AiP technologies in high-volume manufacturing for
the supplier. calls for an extensive toolset to over five years. This includes both
maximize circuit density and support conventional and advanced packaging
As signal loss to the antenna is the sophisticated packaging formats techniques that integrate a laminate
reduced, this may help reduce the required for high-volume production of substrate-based antenna element with a
power requirements compared to the 5G and any mmWave design. Based on transceiver and the associated components
conventional antenna. In addition, the appliation requirements, whether and circuitry to address both sub-6Ghz
AiP reduces the engineering effort 5G or low-power wide-area network and true mmWave products.
and required resources for the OEMs (LPWA N ) or other con nectivit y,
be cau se t he de sig n a nd product customers should be able to select low Summary
are qualified by the supplier. With dissipation factor/dielectric constant Amkor has developed an extensive
this qualification, OEMs can feel substrates, thermal interface materials toolset to maximize circuit density and
confident about introducing a robust (TIMs) for heat dissipation, and a wide address the sophisticated packaging
product in the market much quicker array of different package architectures fo r m a t s r e q u i r e d t o e n a bl e 5 G
with the integrated antenna. In fact, to provide high levels of system and applications – such as double-sided
with proven materials up to 77GHz, sub-system integration. These design assembly, embedded die in substrate,
Amkor’s AiP packaging technologies options require sophisticated models thin-film RDL and dielectrics and various
are shipping products today with over for electrical, thermal and mechanical types of RF shielding techniques. This
60GHz operation. simulations for customers, as well as toolset, combined with expertise in RF
services for design, signal integrity and antenna package design enables
AiP use cases simulations, test and characterization. partnering with customers who want
A variety of AiP use cases exist today, In addition to an advanced multi- to outsource the challenges and high
including: die integration toolbox and RF SiP investment associated with combining
Smartphones. 1) High speed 5G design and simulation know-how, other multiple ICs with advanced package
connectivity to mobile phones; 2) capabilities should include: assembly and test technologies for 5G
Samsung Galaxy S10 contains 3 AiP networks. As demand for packages that
products; and 3) Several new phones • Extensive fcCSP, WLCSP, LDFO support 5G starts to ramp up, we are
coming to market in 2020 with 5G and HDFO portfolios for multi-die already well underway with the successful
enabled (sub-6GHz). designs; implementation of AiP technology.
Small cells. 1) Antenna arrays for small • An established and reliable supply
cells for indoor and outdoor applications; chain; and Reference
2) Last-mile connectivity to bring high- • Global assembly scale and system 1. “ M i l li m e t er Wa v e ( M M W )
speed networks to homes; and 3) High- test investments. Technology Market, Industry Report
speed connectivity in office buildings; 2018-2025,” Grand View Research;
and 4) Connectivity in public spaces like Finally, a complete set of design https://www.grandviewresearch.com/
stadiums, airports, etc. guidelines for system designers allows industry-analysis/millimeter-wave-
Security camera. 1) Connecting them to confidently engage the OSAT mmw-technology-market
5G-enabled security cameras to a that will fully meet their needs.
network; 2) Reduced form factor benefits
because of AiP.

Biographies
Curtis Zwenger is VP, Advanced Package & Technology Integration at Amkor Technology, Inc., Tempe, AZ.
He holds a BS in Mechanical Engineering from Colorado State U. and an MBA from the U. of Phoenix; Email
curtis.zwenger@amkor.com
Vik Chaudhry is Sr. Director, Product Marketing and Business Development at Amkor Technology, Inc.,
Tempe, AZ. He holds a BS in Electrical Engineering from National Institute of Technology, Bhopal, India, and
a Master’s in Electrical Engineering and an MBA from Arizona State U.

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