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SMALL REPEATABLE VOLUMES 6. C. K. Yu, “A unique failure mechanism
ARE A CHALLENGE, BUT NOT induced by chip to board interaction
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Biographies
Gaurav Sharma is a Senior Principal Packaging Engineer at NXP Semiconductors, Austin, TX
USA. He has fifteen years of industry experience in advanced semiconductor packaging and holds a
PhD in Materials Science and Engineering from Pennsylvania State U. and an MBA from National
U. of Singapore. He has published more than forty papers in international journals and conferences.
Email gaurav.sharma_3@nxp.com
Nishant Lakhera is Package Development Manager at NXP Semiconductors, Austin, TX USA and holds a PhD
in Mechanical Engineering from the U. of Wyoming. He is responsible for development and implementation of
electronic packaging solutions for automotive and non-automotive applications.

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