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Figure 6: Graph of warpage improvement vs. parameter settings.
allows minimum, to no introduction of
warpage, as shown in the 200mm wafer
experiment. Further investigation, however,
is needed to see if contactless transport
proves to be more efficient compared to a
pick-and-place method.

Acknowledgment
This article is based on a paper
presented at the International Wafer-Level
Packaging Conference (IWLPC) 2019.

References
1. J. Lau, et al., “Warpage and thermal
characterization of fan-out wafer-
level packaging,” 2017 IEEE Trans.
on Comp., Packaging and Mfg. Tech.,
pp.: 1-10.
2. S. Oldeide, R. Beckmann, L. Giai-
Miniet, K. Reitinger, “Thermal
debonding and warpage adjust
of FOWLP - a crucial step in the
evolution of advanced packaging?”
Inter. Wafer Level Packaging Conf.
(IWLPC), San Jose, CA, 2018, pp. 1-6.

Figure 7: Heat dissipation between contactless vs. the pick-and-place transport method.

Biographies
Debbie Claire Sanchez is Fan-Out Equipment Product Manager at ERS electronic GmbH, Germering,
Germany. She has a Master’s Degree in Physics from the Iligan Institute of Physics in the Philippines, and has
several years of experience in the fan-out field; email sanchez@ers-gmbh.de
Klemens Reitinger is the CEO and CTO at ERS electronic GmbH, Germering, Germany. He has a Master’s
Degree in Mechanical Engineering from the U. of Applied Science in Vienna, Austria, and more than 10 years
experience in thermal debonding and warpage adjustment.

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