Boston, MA USA – September 28 – October 1, 2026

The 59th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging Society and held in Boston, Massachusetts. IMAPS Symposium 2026 will focus on Intelligent Packaging for the AI Era: Heterogeneous Integration and Photonics. It offers one of the most robust programs for microelectronics and advanced packaging technical content. Each year, we welcome many repeat attendees as well as hundreds of first-time visitors – early career packaging professionals, those new to the industry, and students.

Professional Development Courses: September 28
Conference Technical Program: September 29-October 1
Exhibition: September 29 – September 30

All Symposium sessions will take place at the Encore Boston Harbor. Our event kicks off with Professional Development Courses, followed by 3 days of technical sessions with emphasis on Advanced Package Structures (Heterogeneous Integration, HPC, AI); Advanced Interconnect, Bumping & Bonding Technologies; High Reliability, RF/MW, MEMS/Sensors/Flexible, WLCSP, FOWLP, Novel SIP Structures, EV/eVTOL; Enabling Materials & Advanced Equipment and Processes; and Design & Modeling, AI Enablement, CPI and Metrology.  

For Event information: imaps.org/page/IMAPS2026