The 11th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2026) is the premier international event in the field of electronics packaging and system integration. The conference is organized every two years in Europe and is supported by IEEE-EPS in association with IMAPS Europe. The 10th IEEE ESTC will be taking place September 9-11, 2026 in Helsinki, Finland
This year’s IEEE ESTC Conference will feature 105 oral and 108 poster presentations highlighting new developments in advanced packaging, wafer-level packaging, reliability of electronic devices and power electronics, to name but a few topics. As in previous years, the conference papers will be published in the conference proceedings and in the IEEE Xplore database.
We are delighted to welcome five distinguished packaging experts as keynote speakers who will be presenting new findings from their respective areas of expertise.
Other highlights include eight professional development courses on the morning of the first conference day, an EPS HIR Workshop, Special Sessions on various subjects as well as a Panel Discussion.
Please note that changes in the program may still occur.