Tokyo, Japan | Resonac Corporation | April 20, 2026 | Resonac Launches R&D Center for Next-Gen Semiconductor Package Technology under U.S.-Japanese Consortium “US-JOINT” Public and…
Siemens collaborates with TSMC to advance AI for semiconductor design
Plano, Texas, USA – April 22 2026 | Siemens collaborates with TSMC to advance AI for semiconductor design. Siemens collaborates with TSMC to advance AI-powered…
The 76th Electronics Packaging Technology Conference EPTC 2026
The 76th Electronics Packaging Technology Conference EPTC 2026. Bring your networking to the next level at ECTC! With technical sessions, panels, interactive presentations, a high…
MRSI Mycronic announces advanced high-speed 1µm die bonder MRSI-LEAP for ultra-high-volume manufacturing of AI optical module applications
MRSI Mycronic is proud to announce the launch of the MRSI-LEAP high-speed 1µm die bonder. This innovative equipment is designed for ultra-high-volume manufacturing of optical…
FAMES pilot line inaugurated after delivering first validated technical results
FAMES pilot line inaugurated after delivering first validated technical results New cleanroom Is a world-class facility that will host state-of-the-art 300mm semiconductor equipment Grenoble, France…
ASE Unveils IDE 2.0 – AI-Enhanced Platform Accelerates Package Design Accuracy and Innovation
Sunnyvale, CA USA, Nov 04, 2025 – Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today…
Deca and Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
The collaboration provides customers with a modular, memory-centric foundation for advanced multi-die architectures Chandler, AZ. and San Jose, CA., Sept. 10, 2025 (GLOBE NEWSWIRE) — As…
Siemens collaborates with TSMC to accelerate 3D IC and AI-driven circuit and systems design
Plano, Texas, USA – September 24, 2025 | Today at the 2025 TSMC North America Open Innovation Platform® (OIP) Ecosystem Forum, Siemens Digital Industries Software…
Teradyne Unveils Magnum 7H – The Next-Generation Memory Tester for High Bandwidth Memory Devices
NORTH READING, Mass.–(BUSINESS WIRE)– Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, is proud to announce the launch of…
Marvell Develops Industry’s First 2nm Custom SRAM for Next-Generation AI Infrastructure Silicon
Marvell Develops Industry’s First 2nm Custom SRAM for Next-Generation AI Infrastructure Silicon Industry’s highest bandwidth per sq mm with up to 6 gigabits of high-speed…