Tokyo, Japan, March 15, 2024 – Toray Industries, Inc., announced today that it has developed an insulating resin material for hybrid bonding (micro bonding). The…
Scientists develop a revolutionary microelectronic device that uses 1,000 times less power than commercial memory technologies
SINGAPORE – A research team led by the Agency for Science, Technology and Research (A*STAR) in partnership with National University of Singapore (NUS) has created…
IEEE International Workshop on Chiplet Interconnect Test and Repair (CITaR)
The Hague in the Netherlands | May 23-24, 2024 | The first IEEE International Workshop on Chiplet Interconnect Test and Repair (CITaR) focuses exclusively on…
ECTC 2024 – IEEE 74th Electronic Components and Technology Conference – May 28-31 – Denver, CO
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology…
Amkor Technology and GlobalFoundries cut ribbon on strategic cooperation in Portugal
Partnership to strengthen European automotive supply chain and expand services for global customers Tempe, AZ, USA – January 16, 2024 — Amkor Technology, Inc. (Nasdaq:…
ECTC 2024 IEEE 74th Electronic Components and Technology Conference – May 28- May 31, 2024
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology…
Gel-Pak announces new Gel-Probe product line
Hayward, CA, USA –Â Gel-Pak, a Delphon company and a global leader in elastomer-based materials and protective carriers for the semiconductor, medical, and electronics industries,…
The next frontier: Enabling Moore’s Law using heterogeneous integration
By Raja Swaminathan [AMD] Chip Scale Review May • June • 2022 Â
Large-size multi-layered fan-out RDL multi-chip module packaging
Large-size multi-layered fan-out RDL multi-chip module packaging By Nicholas Kao, Jay Li, Jackson Li, Yu-Po Wang[Siliconware Precision Industries Co., Ltd] This article was published in…
Sustaining Moore’s Law with graphene
Since the invention of metaloxide-semiconductor(MOS) integrated circuits in the early 1960s, the speed, capacity, and complexity of the chips have increased dramatically, roughly following Moore’s…