Boston, MA USA – September 28 – October 1, 2026 The 59th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging…
The 11th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2026)
The 11th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2026) is the premier international event in the field of electronics packaging and system integration. The…
Amkor Technology Announces Strategic Partnership with NVIDIA to Expand Advanced Packaging and Test for Next-Generation AI Infrastructure
July 23, 2026 | Tempe, AZ | Amkor Technology, Inc. today announced a multi-year strategic partnership with NVIDIA to develop advanced semiconductor packaging and test…
AMD and Cerebras Announce Industry-Leading Ultra-Low-Latency and High Throughput AI Inference Solution
San Francisco and Sunnyvale, CA USA — July 23, 2026, |AMD (NASDAQ: AMD) and Cerebras Systems (NASDAQ: CBRS) announced a technical partnership to deliver a new…
Resonac Launches R&D Center for Next-Gen Semiconductor Package Technology under U.S.-Japanese Consortium “US-JOINT
Tokyo, Japan | Resonac Corporation | April 20, 2026 | Resonac Launches R&D Center for Next-Gen Semiconductor Package Technology under U.S.-Japanese Consortium “US-JOINT” Public and…
Siemens collaborates with TSMC to advance AI for semiconductor design
Plano, Texas, USA – April 22 2026 | Siemens collaborates with TSMC to advance AI for semiconductor design. Siemens collaborates with TSMC to advance AI-powered…
MRSI Mycronic announces advanced high-speed 1µm die bonder MRSI-LEAP for ultra-high-volume manufacturing of AI optical module applications
MRSI Mycronic is proud to announce the launch of the MRSI-LEAP high-speed 1µm die bonder. This innovative equipment is designed for ultra-high-volume manufacturing of optical…
FAMES pilot line inaugurated after delivering first validated technical results
FAMES pilot line inaugurated after delivering first validated technical results New cleanroom Is a world-class facility that will host state-of-the-art 300mm semiconductor equipment Grenoble, France…
ASE Unveils IDE 2.0 – AI-Enhanced Platform Accelerates Package Design Accuracy and Innovation
Sunnyvale, CA USA, Nov 04, 2025 – Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today…
Deca and Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
The collaboration provides customers with a modular, memory-centric foundation for advanced multi-die architectures Chandler, AZ. and San Jose, CA., Sept. 10, 2025 (GLOBE NEWSWIRE) — As…