There have been any number of market drivers for advanced semiconductor packaging over the years, including improved form factor, power, and operational temperature requirements to accommodate the demand for ever-smaller consumer electronics. Automotive applications have also been a significant driver for packaging. More recently, the semiconductor industry is embracing the process improvements needed to implement artificial intelligence in a broad swath of military and commercial applications. The cover article discusses an integrated wet processing platform that meets the needs of chips for AI applications, and that also has a low cost of ownership.
Cover image courtesy of iStock/Pony Wang