January February 2025
Volume 29, Number 1
There have been any number of market drivers for advanced semiconductor packaging over the years, including improved form factor, power, and operational temperature requirements to accommodate the demand for ever-smaller consumer electronics. Automotive applications have also been a significant driver for packaging. More recently, the semiconductor industry is embracing the process improvements needed to implement artificial intelligence in a broad swath of military and commercial applications. The cover article discusses an integrated wet processing platform that meets the needs of chips for AI applications, and that also has a low cost of ownership.
Cover image courtesy of iStock/Pony Wang
March April 2025
Volume 29, Number 2
Advanced packaging substrates, such as glass-based interposers combined with automated packaging processes, can overcome manufacturing bottlenecks in photonic component assembly. This approach will enable photonic and electronic co- packaged subsystems to scale to large-volume production. As a result, mass market demands--including data center communications, artificial intelligence, sensing and diagnostics—will be addressed. The cover image shows the packaging of a microlens array to a flip-chip assembled InP photonic integrated circuit on a glass electrical
interposer with BGA contacts.
Cover photo courtesy of Tyndall National Institute
