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unreliable (FOWLP, die-to-wafer) or the 2. A . P o d p o d , D. Ve l e n i s , A . bonding for future heterogeneous
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hybrid bonding and 2D material transfer) E. J. Marinissen, et al., “High- 69th Elec. Comp. and Tech. Conf.
requires an alternative approach than the density and high-bandwidth chip- (ECTC), Las Vegas, NV, USA,
more conventional peel debond scheme. to-chip connections with 20µm 2019, pp. 607-613. doi: 10.1109/
pitch flip-chip on fan-out wafer- ECTC.2019.00097
References level package,” 2018 Inter. Wafer 5. T. N. Theis, H.-S. Wong, “The
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Biographies
Koen Kennes is a wafer bonding Engineer in the bonding thinning and assembly team at imec, Leuven
Belgium. He has two years of experience in this team where his focus is mainly on temporary and permanent
bonding as well as laser debonding in various 2D and 3D heterogeneous integration programs. He holds a PhD
in Chemistry from the Catholic U. of Leuven. Email Koen.Kennes@imec.be
Alice Guerrero is a Senior Applications Engineer at Brewer Science, Inc. She is a resident scientist in
partnership with the imec 3D system integration program based in Leuven, Belgium. She has 23 years
experience in product development with a current focus on emerging temporary bond and debond applications.
She holds a PhD in Chemistry from the U. of Illinois in Champaign-Urbana.

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24 Chip Scale Review November • December • 2020 [ChipScaleReview.com]