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and bonded structure,” U.S. Patent 7
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5. Q. Tong, G. Fountain, P. Enquist,
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6. Q. Tong, P. Enquist, A. Rose, “Method
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7, 2003.
7. J. H. Lau, “State-of-the-art of Cu-Cu MICRO DISPENSING
Hybrid Bonding,” IEEE Trans. on
CPMT, Vol. 14, No. 3, March 2024. TECHNOLOGY
8. J. H. Lau, Flip Chip, Hybrid Bonding,
Fan-In and Fan-Out Technology, SMALL REPEATABLE VOLUMES
Springer, New York, 2024. ARE A CHALLENGE, BUT NOT
9. T. Suga, “Feasibility of surface IMPOSSIBLE IF YOU HAVE BEEN
activated bonding for ultra-fine pitch CREATING THEM AS LONG AS WE HAVE.
interconnection – a new concept of
bump-less direct bonding for system
level packaging,” Proc. of IEEE/
ECTC, May 2000, pp. 702-705. TO DO IT WELL,
10. T. Suga, K. Otsuka, “Bump-less WE PROVIDE THREE THINGS:
interconnect for next generation
system packaging,” Proc. of IEEE/
ECTC, May 2001, pp. 1003-1008.
11. M. Kim, H. Lee, A. Jang, W. Lee,
S. Back, I. Kim, et al., “Multi-stack Dispensing Expertise in a variety of microelectronic
hybrid Cu bonding technology packaging applications.
development using ultra-thin chips,”
Proc. of IEEE/ECTC, May 2023, pp. Feasibility Testing & Process Verification based
1672-1676. on years of product engineering, material flow testing
12. K. Taehwan, J. Lee, Y. Kim, H. Park, and software control.
H. Hwang, J. Kim, et al., “Thermal
improvement of HBM with joint Product Development for patented valves,
thermal resistance reduction for dispensing cartridges, needles, and accessories.
scaling 12 stacks and beyond,” Proc. of
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bonding interconnect technology for
higher density and better thermal Our Micro Dispensing product line is proven and trusted by
dissipation of high bandwidth manufacturers in semiconductor, electronics assembly, medical
memory,” Proc. of IEEE/ECTC, May device and electro-mechanical assembly the world over.
2023, pp. 1048-1052. www.dltechnology.com.
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B. Bhushan, B. Street, et al., “Critical 216 River Street, Haverhill, MA 01832 • P: 978.374.6451 • F: 978.372.4889 • info@dltechnology.com
challenges with copper hybrid
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Biography
John H. Lau is a Senior Special Project Assistant at Unimicron Technology Corporation, Taoyuan City,
Taiwan (ROC). He has more than 40 years of R&D and manufacturing experience in semiconductor packaging,
528 peer-reviewed papers (a principal investigator on 380), 50 issued and pending U.S. patents (a principal
inventor on 34), and 23 textbooks (first author on all). He is an ASME Fellow, IEEE Fellow, and IMAPS Fellow.
He earned a PhD degree from the U. of Illinois at Urbana-Champaign. Email John_Lau@unimicron.com

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