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INDUSTRY EVENTS

ECTC 2024: New, larger venue

By Michael Mayer [University of Waterloo, and 74th ECTC Program Chair]

I Electronic Components and Technology Conference next-generation communication systems, photonics, as well as

t is my pleasure to invite you to the 74th IEEE
topics in workforce diversity and the CHIPS Act initiative. The
(ECTC) Program, which will be held from May 28–31,
2024, for the first time in the Centennial state, Colorado, Technology Corner Exhibits showcased products and services
from 117 companies. The 73rd ECTC received valuable support
at the Gaylord Rockies Resort and Convention Center in Denver. from our awesome sponsors.
On behalf of the ECTC’s Executive Committee and Program At the 74th ECTC Conference we plan to uphold ECTC’s
Committee, I welcome our colleagues from all over the world to tradition as the premier platform to showcase the latest
this IEEE/EPS sponsored event. developments in the electronic components industry, where
packaging drives device and system performance.
The 74th Electronic Components and Technology Conference
(ECTC) promises an extensive technical program, featuring over
375 technical papers presented across 36 oral sessions and five
interactive presentation sessions. Key topics span advancements
in packaging technologies, heterogeneous integration, systems
design, and next-generation substrate manufacturing. Reliability
aspects cover advanced substrates, high-density packages, and
harsh environment reliability, while assembly and manufacturing
technology sessions delve into 3D integration, bonding, and
die bond/board-level reliability. RF, high-speed components,
and systems topics include antenna-in-package design, signal
integrity, and chiplet interconnect validation; and emerging
Hotel Gaylord Rockies, Colorado technologies sessions explore digital healthcare, AI, quantum
computing, and additive manufacturing for printed electronics.
ECTC is the premier international conference in electronics This year, hybrid bonding features prominently at ECTC. Hybrid
packaging technology. Electronics packaging for microchips bonding is a cutting-edge packaging technology that promises to
increasingly plays a pivotal role throughout the microelectronics achieve the benefits of heterogeneous integration using innovative
production chain covering the function of microchip protection techniques for direct-joining processes. Hybrid bonding plays
and allowing for increasingly complex and powerful systems. a role in achieving enhanced reliability in advanced substrates
As microchips continue to evolve, their electronic packaging and interconnects, including copper hybrid bonding for various
safeguards against premature failures and contributes to the applications. These sessions delve into the materials and processes
overall durability and performance of all electronic devices, driving the evolution of hybrid bonding in microelectronics.
ensuring the microchips remain in their pristine shape for Photonics takes center stage at ECTC with sessions like "Co-
many years. To this end, ECTC covers a broad range of Packaged Optics,” "Optical Interconnections,” and "Photonics
topics, including components, materials, assembly, reliability, Integration, Materials, and Processes.” These sessions explore
modeling, interconnect design and technology, direct the transformative role of photonics in microelectronics
bonding and hybrid bonding, device and system packaging, packaging, exploring the integration of optical components
heterogeneous integration, wafer-level packaging, photonics within semiconductor packages, optimizing communication
and optoelectronics, Internet of Things (IoT), 5G, quantum within electronic systems, advancing data transmission
computing and systems, 2.5D and 3D integration technology, through light, addressing signal integrity challenges, advanced
and other emerging technologies in electronics packaging. materials and processes, all aiming at enhanced communication
The ECTC Program Committee comprises 200+ experts from bandwidth and system efficiency, paving the way for even more
diverse technical fields and is dedicated to creating an engaging energy-efficient and high-performance microelectronic devices.
technical program. ECTC regularly draws over 1,500 attendees Special sessions with industry experts include a focus on
from 20+ countries. The 73rd ECTC was held in person and Industry-Government Co-Investments for the Advanced
welcomed 1,619 registered attendees from 26 countries. It Electronics Sector globally, advancing metrology for next-
featured 369 technical papers presented in 36 oral sessions and generation microelectronics, and innovative solutions for
five interactive sessions, including a student-focused session. power-hungry AI/ML applications in a session on Thermal
Additionally, nine special sessions covered various topics Management for AI. An RF Packaging session above 100 GHz is
with respect to advanced packaging for harsh environments, scheduled, along with a Young Professionals Networking Event
hybrid bonding, high-density substrates, quantum computers, and an IEEE EPS Seminar on Substrates for Chiplets.

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