Page 53 - Chip Scale Review_March-April_2024-digital

On May 29, 2024, Prof. Keren dense wavelength-division multiplexing, in this unique event, providing a
Bergman of Columbia University to achieve Pet abit /s chip escape platform for exploring cutting-edge
will present the keynote on Petascale bandwidths with sub-picojoule/bit advancements, fostering innovation,
photonic chip connectivity for energy- energy consumption. and addressing critical challenges. The
efficient AI computing. This is important The conference also feat ures a conference is scheduled from May 28
in data centers, where connecting Diversity and Career Growth Panel and to 31, 2024, at the Gaylord Rockies
nu me rou s c omput e a nd me mor y Reception, a Plenary Session on the Resort & Convention Center in Denver.
resources will profit from lower energy Future of Semiconductor Industry, and a The hotel is renowned for its stunning
and communication costs via integrated panel session on Workforce Challenges in architecture, luxurious amenities, and
silicon photonics provided multi-chip Education and Workforce Development scenic surroundings. Boasting a majestic
packaging challenges are addressed. in the New Chips Economy. backdrop of the Rocky Mountains,
This talk explores approaches, including In addition to the technical program, the resort provides a picturesque and
E CT C of fe r s 16 C EU - ap p rove d tranquil setting for the 74th ECTC.
Professional Development Courses With its spacious accommodations and
(PDCs) on May 28th, co-located with the state-of-the-art facilities, the Gaylord
IEEE ITherm Conference. ECTC also Rockies offers an inviting atmosphere
includes an exhibition, running from that complements the professional and
May 29th to May 30th, showcasing the collaborative spirit of ECTC. Attendees
latest technologies and products from can expect an enjoyable and productive
over one hundred exhibiting companies stay in this remarkable venue.
in the electronic components, materials, I sincerely express my gratitude to
packaging, and services fields. Attendees sponsors, exhibitors, authors, speakers,
can engage in networking opportunities PDC instructors, session chairs, program
during coffee breaks, daily luncheons, committee members, and volunteers for
and nightly receptions. contributing to the success of the 74th
ECTC invites engineers, managers, ECTC. I look forward to meeting all of
st u de nt s , a nd exe c ut ive s i n t he you on May 28 in Denver, Colorado!
m icroelect ron ics pack ag i ng a nd
Prof. Keren Bergman (Columbia University) components industry to participate

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