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350+ TECHNICAL PAPERS HIGHLIGHTS
COVERING: n 41 technical sessions with a
Advanced Packaging Design, total number of 350+ technical
Processes, Reliability, Modelling papers including:
Hybrid Bonding & Advanced • 5 interactive sessions
Interconnect including one student
session
Fan-Out Wafer Level & Panel Level
May 28 - May 31, 2024 Optics and Photonics Packaging n 9 special invited sessions
Additive Manufacturing
n 16 CEU-approved Professional
Quantum and AI Systems Development Courses
Gaylord Rockies Resort High-Density 3D & Substrates n Multiple opportunities for
networking
Heterogeneous Integration
& Convention Center Chiplets n Technology Corner Exhibits,
showcasing industry-leading
Denver, Colorado, USA High-Power & Thermal product and service companies
Management
from around the world
Flip Chip, Die Bond, Chip Scale n Various sponsorship
Flexible & Wearable
Don’t Miss Out on the RF Components, Antennas opportunities for your
company’s visibility
Industry’s Premier Event! Harsh Environment Reliability and n ECTC Gala and evening
Automotive receptions
The only event that encompasses
the diverse world of integrated
systems packaging.
www.ectc.net
For more information, visit:
Conference Sponsors: Official Media Sponsor:
ADVERTISER INDEX
Amkor Technology ...................................................... 4, 5
Br ewer S cience ..................................................... 12
C or ning ................................................................. 15
DL Technology ......................................................... 49
E-tec Interconnec t ................................................... 30
EC T C .................................................................. 52
EV Group ..................................................................... 2
Intek plus Co., Ltd ................................................... 25
I r on w o od E l e c t r on i c s ......................................... 4 6
ISC Co., Ltd. ........................................................... 36
JC CHERRY .............................................................. 38
Leeno Industrial ............................................... IFC, IBC
M i c r o C i r cu it L a b o r a to r i e s ..................................... 44
M i c r o C o n t r o l C o m p a n y ........................................ 9
MRSI Sys tems .......................................................... 40
N o r d s o n Te s t & I n s p e c t i o n ............................... 10,11
O n t o I n n o v a t i o n ...................................................... 41
PacTech ..................................................................... 31
Plasma Etch ........................................................... 52
Soni x ..................................................................... 22
SPIL ........................................................................ OBC
Technic ................................................................... 17
TSE Co. Ltd ........................................................... 26,27
WinWay Technology ................................................. 20
May June 2024
For Advertising Inquiries: ads@chipscalereview.com
52 Chip Scale Review March • April • 2024 [ChipScaleReview.com]
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