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Figure 7: Production test for power, data I/O, bias and clocks in multi-die packages.
IEEE1838 [1] is one such standard
that helps during the architecture phase
of the product. Test access to each
chiplet and all the functional blocks
within is a “must have,” to allow full
production testing.
I E E E -16 8 7 [ 2] d e s c r i b e s t h e
t e s t me t ho dolog y for a c c e s si ng
instrumentation embedded within
a semiconductor device. Electronic
data automation (EDA) vendors have
defined intellectual property (IP)
blocks to monitor environmental
attributes including process, voltage
and temperature (PVT) on-die. They
have a similar concept of adding
se n sor s w it h i n t he log ic de sig n
a nd have docu ment ed nu me rou s
benefits to the overall manufacturing
workflow. PVT sensor placement in
the vicinity of the thermal congestion
is vital to analyze the severity and Figure 8: Block representation of Package Environmental Control with a variety of sensors that allow a
se n sit iv it y of t he r m al de n sit ie s telemetry stream to monitor package health during active operation, including the production test process.

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