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Figure 6: AMD’s Instinct™ MI250X compute accelerator with Si-bridge for chiplets on the build-up package substrate without a cavity.
Figure 7: Apple’s UltraFusion with Si-bridge for SoCs on the build-up package substrate without a cavity. (SEM image provided by TechInsights Inc.)
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42 Chip Scale Review November • December • 2023 [ChipScaleReview.com]
