Page 39 - Chip Scale Review_November-December_2023-digital

Organization Size) – Global
Market Size, Trend Analysis,
Segment Forecast, Regional
Outlook 2023-2032
2. Oracle: htt ps://www.oracle.
com/my/cloud/hpc/what-is-hpc/
3. “H y pe r i o n R e s ea r c h
U p d a t e : IS C 1 9,” h t t p s :/ /
hy p e r ion re se a rch.com /w p -
c o n t e n t / u p l o a d s / 2 019 / 0 6 /
H y p e r i on -R e s e a r c h -
ISC19 -Bre a k fa st-Br ief i ng-
Presentation-June-2019.pdf
4. K . A d o d a r i y a , “ S o C
interconnect challenges and
history,” https://www.linkedin.
com/pulse/soc-interconnect-
challenges-history-kashyap-
adodariya/

P
RoHS

Biographies
Xin-Reng Foo is Principal Member of Technical Staff at AMD Singapore. He has over 18 years of industry
experience and leads all aspects of sort hardware and sort equipment development for new products (for
production deployment). He holds an Electrical Engineering degree from Queensland U. of Technology. Email
xin-reng.foo@amd.com

Chee Hoe Lin is Senior Member of Technical Staff at AMD Singapore. He has been at AMD for 18+ years
and is responsible for driving many signal integrity projects from concept to production deployment. Prior to
joining AMD, he graduated from Queen’s U. Belfast with a degree in Electrical Engineering. His current focus is driving the SI
works for next-generation HSIO test platform design.

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