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INDUSTRY EVENTS

IMAPS Symposium 2023: A cornucopia of

technical content, networking and exhibits

By Suresh Jayaraman [General Chair of IMAPS Symposium, 2023, and Amkor]
A s General Chair, it was a great pleasure to captain My takeaway was that there is probably room for both technologies,

as well as other variants, such as silicon bridges (chip-on-wafer-on-
the 56th IMAPS Symposium (Figure 1). It was a
®
successful event all around and would not have been
possible without the help of the wonderful staff and substrate-local silicon interconnect +RDL interposer [CoWoS -L]).
C. P. Hung (ASE) underscored the importance of HI in
volunteers working behind the scenes to make sure the attendees addressing emerging automotive, high-performance computing
had a great experience. Thanks to the committee for working (HPC), and AI applications. It was encouraging to see that
tirelessly in putting an excellent program together—it takes a advanced packaging is getting a lot of attention and traction.
village to organize a conference of this magnitude. Nearly 800 The topic for the panel discussion, “The Future of Packaging for
people joined the event, including 87 from outside the U.S. Artificial Intelligence,” also addressed the theme of the conference
and the eminent panelists provided great insights into the current
state of affairs, as well as what they saw coming down the pipeline
(Figure 2). Advanced packaging and HI to address chiplets are
here to stay!
Everyone enjoyed the networking at the welcome reception
(Figure 3, 4), lunch breaks, exhibit hall happy hour, and poster

Figure 1: Suresh Jayaraman, General Chair.
This year we had an unprecedented 14 Professional Development
Courses (PDCs), with one added in the topical area of artificial
intelligence (AI), which was very well attended. There is also a
thrust to post the PDCs online through IMAPS Academy, which
would serve the student community well. The DEI (diversity, equity,
and inclusion) town hall was very well attended and engaging. Figure 2: AI panel.
The panel had some interesting thoughts and responses to various
questions relating to DEI in the workplace, mentoring, and how the
glass ceiling for women is being broken in the packaging field.
We had a terrific lineup of keynotes starting with Kevin
Anderson (Qorvo) providing an overview of the SHIP program and
a good summary of the capabilities. Jeff Burns (IBM) enlightened
attendees about foundation models and how they help scale up
AI for various applications. He also provided some insight into
the various research thrust areas in the heterogenous integration
(HI) domain at IBM Research Centers. Shin-Puu Jeng (TSMC)
showed how organic interposers (chip-on-wafer-on-substrate-
®
RDL interposer, CoWoS -R) will likely take the baton from
®
Si interposers (CoWoS -S) and extend the reach of HI to help
address the exponential growth in compute requirements for AI
applications. An answer to the question regarding manufacturability
of organic interposers suggested that a lot needs to be done to
increase yields sufficiently to scale to high-volume manufacturing.
Figure 3: Networking break.

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