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Figure 5: Recent DP-D2W bonding results using EVG320 D2W activation and cleaning followed by ASMPT LithoBolt die bonding: a) Alignment verification result using
COG (9x9mm glass chip), face-down mode; achieving specification below 200nm at 3σ; b) post-bond scanning acoustic microscope; and c) photography of the bonded
dies on the wafer.
consider not only the wafer bonding Summary References
equipment, but also the materials The utilization of D2W hybr id 1. IEEE Heterogeneous Integration
involved in temporary and permanent bonding is crucial for the swift adoption Roadmap, Ch. 2.
bonding, as well as related processes of 3D/heterogeneous integration and the 2. J. Burggraf, M. Pires, T. Uhrmann,
such as die activation and cleaning, development of next-generation devices “Collective die bonding - an
as well as subsequent die bonding. that offer superior performance, high enabling toolkit for heterogeneous
Process expertise and access to cutting- bandwidth, and low power consumption. integration,” PRiME 2020 (ECS,
edge technologies are essential, but Even though the infrastructure for ECSJ & KECS Joint Meeting), 2020.
these systems are often already in D2W hybrid bonding is still evolving, 3. T. Uhrmann, et al., “D2W hybrid
use at customer sites and may be an increasing number of process bonding using high-accuracy carrier
difficult to access for research and solutions and collaborations across the solutions for 3D system integration,”
development purposes. To overcome supply chain are emerging and will 2023 IEEE ECTC.
these challenges, EVG established the be integral in establishing the best 4. C. H. Fan, et al., “Direct die-to-
Heterogeneous Integration Competence practices for D2W hybrid bonding. Close wafer Cu hybrid bonding for volume
Center (HICC), which leverages EVG cooperation and seamless optimization production,” 2023 IEEE ECTC.
process solutions and expertise to between equipment design and process 5. A. Elsherbini, et al., “Enabling
enable new and improved products and integration in appropriate testing labs next-generation 3D heterogeneous
applications driven by advancements in are necessary for qualifying and refining integration architectures on Intel
system integration and packaging, using D2W hybrid bonding. process,” 2022 International Electron
ASMPT’s latest-generation die bonding Devices Meeting, pp. 27.3.1-27.3.4.
equipment. ASMPT has also established Acknowledgements 6. A. Bond, et al., “Collective die-
an advanced lab in Hong Kong, focused The authors express their gratitude to-wafer self-assembly for high
on overlay and including EVG’s die to Jürgen Burggraf and Mariana Pires alignment accuracy and high-
cleaning and activation capabilities. from EV Group, as well as Hoi Ping Ng, throughput 3D integration,” 2022
These incubators were established Ming Li, and Siu Cheung So from ASM IEEE ECTC, pp. 168-176.
to lower the barriers to development Pacific Technology, for their valuable
for customers. contributions to this paper.

Biographies
Thomas Uhrmann is Director of Business Development at EV Group, Austria. He is responsible for
overseeing all aspects of EVG’s worldwide business development. Previously, he was Business Development
Manager for 3D and advanced packaging, as well as compound semiconductors and Si-based power
devices at EV Group. He holds an Engineering degree in Mechatronics from the U. of Applied Sciences
in Regensburg, and a PhD in Semiconductor Physics from the Vienna U. of Technology (TU Wien).
Email: T.Uhrmann@EVGroup.com
Nelson Fan is Vice President of Business Development, Advanced Packaging Technology, at ASM Pacific Technology
(ASMPT), Hong Kong SAR, China, where he focuses on high-precision bonding and pick-and-place solutions for advanced
packaging. Prior to joining ASMPT, he held multiple senior management roles in R&D and manufacturing in both OSAT and
design houses. He has more than 40 US patents in semiconductor packaging technologies and holds a Bachelor’s degree in
Electrical Engineering from the U. of Colorado at Colorado Springs, USA.

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