Page 19 - Chip Scale Review_March April_2023-digital

cleanliness and activation are similar to a powerful optical system to assist in (Y-direction) for the two corners accuracy
those of other fusion bonding techniques. sub-micron-level pattern-recognition as shown in Figure 5. Cleanliness
The dies require repopulation on a alignment. The bond head module assessment data showed that LithoBolt
dedicated cleaning carrier wafer and may incorporates intelligent design to enable achieved ISO3 cleanroom standard both
need optional cleaning during dicing true active alignment with real-time in idle and operation modes.
before transport to the front-end clean compensation. The alignment accuracy
hybrid bonding step. Surface coating on verification was performed using chip- Accelerating process development
a readily CMP-treated wafer is crucial on-glass (COG) for face-down mode Manufact u rers must u nder take
to preserve surface properties and bonding, and overall results achieved extensive development projects to
cleanliness during dicing. under 3σ were 106nm and 103nm determine the optimal bonding method
The EVG320 D2W is a flexible die (X-direction) and 131nm and 147nm for their devices. These projects must
preparation and activation system
designed to seamlessly integrate with
ASMPT’s pick-and-place die bonding
systems. It is equipped with a universal
hardware/software interface and can
be used as a stand-alone system. The
system incorporates cleaning and plasma
activation technology, and features an
optional integrated metrology module
that provides direct feedback to the die LEADERS IN
bonder on critical process parameters,
such as die placement accuracy and MICRO DISPENSING
die-height information, for improved
process control. TECHNOLOGY
After die preparation, the high-
precision D2W die pre-bond step is SMALL REPEATABLE VOLUMES
carried out using ASMPT’s LithoBolt— ARE A CHALLENGE, BUT NOT
an automatic ultra-high-precision die IMPOSSIBLE IF YOU HAVE BEEN
bonding system. The system is designed CREATING THEM AS LONG AS WE HAVE.
to achieve high accuracy, throughput, and
yield for volume production. Material
handling for cleanliness control and
alignment mechanism to achieve target TO DO IT WELL,
alignment accuracy are crucial in this
step. The cleaned and activated die WE PROVIDE THREE THINGS:
and target wafer materials from the die
preparation machine are transported to
the load port of the equipment front-
end module (EFEM) of the die bonding Dispensing Expertise in a variety of microelectronic
system through a cleaned front-opening packaging applications.
unified pod (FOUP). The die is then
bonded onto the target wafer under a Feasibility Testing & Process Verification based
compression force of 0.05 to 0.3MPa on years of product engineering, material flow testing
with a special curved collet. The force- and software control.
controlled bond-arm of the bonder adjusts
the compression force for bonding. Product Development for patented valves,
Cleanliness must be well controlled dispensing cartridges, needles, and accessories.
throughout the entire material handling
and bonding process inside the EFEM
and bond chamber.
Die placement alignment accuracy is
another crucial requirement in the die
bonding step. Currently, the industry is Our Micro Dispensing product line is proven and trusted by
calling for alignment accuracy below manufacturers in semiconductor, electronics assembly, medical
200nm at 3σ for bond pad sizes below device and electro-mechanical assembly the world over.
10µm, and future bonding solutions www.dltechnology.com.
should have accuracy down to 100nm or
below. LithoBolt utilizes a new concept
of alignment approach supported by 216 River Street, Haverhill, MA 01832 • P: 978.374.6451 • F: 978.372.4889 • info@dltechnology.com

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