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References
1. B. Sabi, “Advanced packaging in the
new world of data,” Elec. Comp. and
Tech. Conference (ECTC) 2017.
2. Po-Yao Chuang, “Hybrid fan-out
package for vertical heterogeneous
integration,” IEEE 70th ECTC 2020.
3. Q. Ding, “High-bandwidth low-
power 2.5D interconnect modeling
and design,” IEEE 70th ECTC 2020.
4. R. M a h a j a n, “S c a l i n g f o r
heterogeneous integration,” Georgia
Tech Packaging Research Center
Industry-Academic Consortium
2020.
5. R. Manepalli, “Advanced packaging
technologies for heterogeneous
i nt eg r at ion: chal le nge s a nd
oppor t u n ities,” 31st A n nual
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6. L. Cao Teck Lee, “Advanced HDFO
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7. Y. P. Chiang, “InFO_oS (Integrated
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8. JiHun Lee, “S-Connect Fan-
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9. JaeYoon Kim, “Chip-last HDFO
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10. G. Pan, “Warpage assessment
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Biographies
Nicholas Kao is a Department Manager, Corporate R&D at Siliconware Precision Industries Co., Ltd., Taichung,
Taiwan, R.O.C. He received his MS degree from the Institute of Applied Mechanics of National Taiwan U. in 1999 and
has 22 years of industry experience focusing on package stress analysis, stress measurement and product application
analysis. He has published over 20 conference papers and patents. Email nicholas@SPIL.com.tw

Jay Li is a Deputy Manager, Corporate R&D at Siliconware Precision Industries Co., Ltd., Taichung, Taiwan,
R.O.C. He received his MS degree from National Central U., Taiwan and MBA degree from San Diego State U.,
U.S.A. He is focusing on 2.5D, 3DIC, FO-MCM, and FO-EB advanced packaging research. He has over four years working in
the semiconductor industry and has published four papers.

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