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work on the same design across local or
global networks yet retain the ability to
visualize all design activity. Obviously,
to make co-optimization practical and
profitable, designers must be able to
collaborate without onerous set up or
process management.
A 3D digital model (i.e., the digital
twin) of the FOWLP assembly provides
a comprehensive representation of the
full system comprising multiple devices
Figure 3: Three substrate levels from different design teams.
and substrates. With a digital twin, each
team can design and verify their piece
in the context of the entire system, even
if other teams’ design work is not yet
complete. This co-optimization approach
ensures overall system success when all
components are completed and integrated
LEADERS IN together (Figure 2).
Once the digital twin is complete,
MICRO DISPENSING extensive validation and verification of
the design before it moves to fabrication
TECHNOLOGY and assembly means problems and
issues can be found and resolved without
disrupting the current design process or
SMALL REPEATABLE VOLUMES methodology. Teams can also review the
ARE A CHALLENGE, BUT NOT architecting and planning process and
IMPOSSIBLE IF YOU HAVE BEEN use it as a left-shift strategy to drive a
CREATING THEM AS LONG AS WE HAVE. validated, optimized concept that can
greatly reduce implementation and final
validation/sign off issues.
Constructing a digital twin for a
TO DO IT WELL, FOWLP enables designers to work
WE PROVIDE THREE THINGS: through a series of critical “what
if” questions and resolve numerous
ch a l le n ge s b efo r e a ny p hy sic a l
construction begins. Using the digital
twin also enables teams to design and
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completion status of other teams’
Feasibility Testing & Process Verification based component s. T h is i nde pendence
on years of product engineering, material flow testing ensures overall system success when
and software control. all components are completed and
integrated together.
Product Development for patented valves, The digital twin provides a model
dispensing cartridges, needles, and accessories. of the entire package assembly—a
“blueprint”—that drives all levels of
implementation, verification, analysis,
and manufacturing. The digital twin
eliminates the use of multiple static
spreadsheets to represent pin and
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bridges, and package substrates).
64 Chip Scale Review November • December • 2021 [ChipScaleReview.com]
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