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such as DPS boards that do not require
a lot of vector memory, such integration
can eliminate the need for an additional
memory chip, resulting in more fully-
independent pins in a small form factor.
There are several other factors
to consider when choosing ATE for
semiconductor devices targeting
convergence and exascale computing
applications. Choose a platform that
can be configured to scale from an
engineering station to a full high-volume
multisite production system that can
cover all application segments. Choose
a system that is compatible with your
existing device under test (DUT) interface
boards while offering a seamless upgrade
path to larger load boards. Water-cooled
instruments can achieve the highest levels
of accuracy and repeatability. Still other
factors to consider include instrument and
software compatibility.
Figure 2: ATE designed to test high-performance devices for the age of convergence and exascale computing
can benefit from a computing network that interconnects the system, card-cage, instrument, and test- ATE for the exascale age
processor levels. An example of an ATE system designed
instrument level, and test-processor level synchronization, and power ganging to address the age of convergence and
(Figure 2). A dedicated communications while enhancing throughput and multisite exascale computing is the Advantest
bus that is embedded in the test system efficiency (MSE). V930 0 0 EX A Scale. T he system
and that exhibits very low latency can Advanced packaging technologies incorporates the company’s Xtreme Link,
support concurrent communications at also have a role to play. They can allow a specialized ATE network with edge-
the system, card-cage, instrument, and the tester maker to use 2.5D integration computing capabilities. Xtreme Link
test-processor levels, facilitating pin- to combine a test system and memory makes use of an optimized protocol
to-pin communications for protocols, in a single package. For instruments focused on test needs and requirements—
such as high throughput and MSE as well
as large test-data handling capabilities—
that would not be available with an off-
the-shelf communications technology like
Gigabit Ethernet.
Instruments for the EXA Scale system
include the DC Scale XPS256 DPS
card, which offers 256 pins at 1A and
which limits droop to less than 40mV
after any load step to ensure a stable
supply voltage for high-performance
DUTs designed for mobile, HPC, AI,
and other convergence applications. The
water-cooled instrument offers full four-
quadrant voltage-current capabilities
and an accuracy of ±150µV, a level that
can help tester customers achieve higher
yields for devices such as AI processors
or top-of-the-line GPU or CPU.
Another instrument for the EXA Scale
system is the Pin Scale 5000 digital card,
which offers 256 pins running up to
5000Mbps maximum speed with less than
1.5ps of RMS jitter to enable accurate
reference clocks. It supports scan-
test result capture at up to 5000Mbps
Figure 3: This Pin Scale 5000 phase-noise measurement example shows that the RMS jitter is just 0.9ps— and is designed to enable all scan
well below the specified 1.5ps.
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