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output formats that designers need for is the key to achieving first-pass, high- processes for analysis and verification
successful design—all of which have yield success for packaging technologies of FOWLP assemblies. Combining the
been tested, qualified, and proven to such as FOWLP. digital twin approach with industry
produce working products. A complete standardization and EDA tool automation
ADK must work across both IC and Summary is an essential part of a unified approach to
packaging domains, implying that the Next-generation packaging solutions providing proven, qualified sign off flows
flow must support multiple formats: IC like FOWLP require innovative design for automated heterogeneous verification.
layout design formats as well as package strategies coupled with standardized
formats. By implementing a standardized, design requirements and a proven, References
proven process, all participants can automated sign off for physical, electrical, 1. Prismark Partners LLC, “The
improve both their first-time success rate thermal, and manufacturing performance, Printed Circuit Report,” Aug. 2020,
and overall product quality. all within a single environment that www.prismark.com.
Creating an ADK is a non-trivial enables designers to manage all of these 2. “Intel leans hard on advanced chip
effort, requiring cooperation and processes in an efficient, repeatable, and packaging technologies in battle for
collaboration between design houses, automated flow. computing supremacy,” Business
assembly houses, and electronic design The digital twin methodology enables Telegraph, Sept. 16, 2020, https://
automation (EDA) vendors. Yet using design companies to create and maintain www.businesstelegraph.co.uk/
an ADK can reduce the risk of package a single, comprehensive, and standardized intel-leans-hard-on-advanced-chip-
failure while also reducing turnaround representation of the full system that packaging-technologies-in-battle-
time for both the component providers facilitates the use of automated electronic for-computing-supremacy/
and assembly houses. In short, an ADK design automation (EDA) tools and

Biography
Keith Felton is the Marketing Manager for Xpedition IC Packaging solutions at Siemens EDA, in
Marlborough, MA. Working extensively in IC package design since the late 1980s, Keith drove the launch of the
industry’s first dedicated system-in-package design solution in the early 2000s and led the team that launched
Mentor’s OSAT Alliance program. His current focus includes driving the strategy and direction for Siemens
EDA’s multi-substrate prototyping, design, and verification solution for high-density advanced packages. Email
keith_felton@mentor.com

John Ferguson is Director of Marketing for the Calibre DRC product line for Siemens EDA in Wilsonville, OR. He received a
BS in Physics from McGill U., an MS in Applied Physics from U. of Massachusetts, and a PhD in Electrical Engineering from
the Oregon Graduate Institute of Science and Technology. He has worked extensively in physical design verification. Current
activities include efforts to extend physical verification and PDK enablement for 3DIC design and silicon photonics.

ADVERTISER INDEX

Amkor Technology www.amkor.com ........................................ 1 Mosaic Microsystems www.mosaicmicro.com ......................... 11
Brewer Science www.brewerscience.com ...................... 58 MRSI Systems www.mrsisystems.com ................................... 41
Contech Solutions www.contechsolutions.com ........................ 23 NXP Semiconductor www.nxp.com/S32K3 ................................... 29
CyberOptics www.cyberoptics.com ............................................. 39 Pac Tech www.pactech.de ................................................... 48, 65
DL Technology www.dltechnology.com ............................... 64 Plasma Etch www.plasmaetch.com ............................................. 61
E-tec Interconnect www.e-tec.com ........................................... 67 Screen Semiconductor Solutions
www.screen.co.jp/spe/en/products .............................................. OBC
EV Group www.evgroup.com ....................................................... 2
SEMI Europe www.semi.org/eu ............................................. 62
INTEKPLUS Co., Ltd. www.intekplus.com ............................ 14
Siemens Digital Industries Software
Ironwood Electronics www.ironwoodelectronics.com ........... 59 www.sw.siemens.com .......................................................... 20
ISC Co. Ltd. www.isc21.kr ................................................... 25 Sonix www.sonix.com ..................................................... 67
ITW EAE www.itweae.com .......................................................... 51 SÜSS MicroTec www.suss.com .......................................... 43
Johnstech International TSE Co. Ltd www.tse21.com .................................................. 4,5
www.johnstech.com/markets/automotive ................................... IBC
Universal Instruments www.uic.com .................................... 16
LB Semicon www.lbsemicon.com ................................................... 55
UTAC Group www.utacgroup.com ............................................ 9
Leeno Industrial www.leeno.com ....................................... IFC, 36
WinWay Technology www.winwayglobal.com ....................... 56
MacDermid Alpha www.macdermidalpha.com ......................... 30
Xperi www.invensas.com ........................................................... 6
Micro Control Company www.microcontrol.com .............................. 34
Yield Engineering Systems www.yieldengineering.com ............ 47
January February 2022 • Space Close January 21 • Ad Materials Close January 25 • For Advertising Inquiries • ads@chipscalereview.com

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