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Summary
          The feasibility of using hybrid
        metal/graphene structures for sub-
        2nm interconnect applications was
        discussed. Two different structures were
        examined: graphene-capped metal and
        metal-capped graphene devices. In both
        cases, the interfaces between graphene
        and metal play a crucial role in the
        overall electrical behavior of the hybrid
        interconnect. While graphene-capped
        metal interconnects are the most mature,
        stacks of alternating layers may come
        into play in the longer term. It should
        finally be noted that the above study
        focused on Ru as a metal of interest, a
        material that has recently emerged as a
        potential alternative for Cu metallization.
        But the concepts presented here are
        expected to be expandable towards other
        “interconnect” metals.

        References
          1.  C. Adelmann, et al., “Alternative
            metals: from ab initio screening
            to calibrated narrow line models,”
            Proc. IEEE IITC 2018, pp.: 154-156
          2.  S. Ach ra, et al., “G raphene-
            ruthenium hybrid interconnects,”
            Proc.  IEEE  IITC  2019;  To  be
            published.
          3.  S. Achra, et al., “Characterization
            of interface interactions between
            graphene and ruthenium,” Proc.
            IEEE IITC 2020, pp.: 133-135
          4.  S. Achra, et al., “Metal induced
            charge transfer doping in graphene-
            ruthenium hybrid interconnects,”
            Carbon 183 (2021) 999-1011.
          5.  S. Achra, et al, “Enhancing interface
            doping in graphene-metal hybrid
            devices using H2 plasma clean,”
            Applied Surface Science 538 (2021)
            148046.





                       Biographies
                         Swati Achra is pursuing a PhD in Materials Engineering in the MTM department, KU Leuven and at imec.
                       She joined the Nano-interconnects team at imec in 2017 and works on developing graphene-enabled hybrid
                       interconnects for future technology nodes. She received a joint MSc degree in Erasmus Mundus Masters in
                       Nanoscience and Nanotechnology magna cum laude from KU Leuven, Belgium and U. Grenoble Alpes, France in
                       2017. She graduated B.Tech in Chemical Engineering and Materials Science with a university gold medal in 2015
                       from Amrita Vishwa Vidyapeetham, Tamil Nadu, India. Email swatiachra92@gmail.com; swati.achra@imec.be

            Inge Asselberghs is Program Manager for exploratory logic at imec, Leuven, Belgium. She received MSc and PhD degrees
          in Chemistry from the U. of Leuven, Leuven, Belgium, in 1998 and 2003, respectively. After a Post-Doctoral Fellowship in
          nonlinear optics, she moved to imec, Leuven, as a Researcher, where she was involved in exploratory 2-D-material-based device
          fabrication and characterization.


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