Page 41 - Chip Scale Review_November December_2021-digital
P. 41

Seriously Fast.




                           WX3000™ Metrology and Inspection Systems for


                                             Wafer-Level and Advanced Packaging













                                                                           Copper Pillar











                                                                           Flip Chip (c4)





                                                    2-3X
                                                    Faster


                                                                           Micro Bump






             2-3X Faster with High Resolution and High Accuracy

             WX3000 3D+2D metrology and inspection system provides the ultimate
             combination of high speed, high resolution and high accuracy for wafer-level and

             advanced packaging applications to improve yields and processes.


             Powered by Multi-Re ection Suppression™ (MRS™) Sensor Technology
             The 3-micron NanoResolution (X/Y resolution of 3 micron, Z resolution of 50 nanometer) MRS sensor enables
             metrology grade accuracy with superior 100% 3D and 2D measurement performance for features as small as
             25-micron. 100% 3D and 2D metrology and inspection can be completed simultaneously at high speed (25 300mm
             wafers/hour and 55 200mm  wafers/hour) as compared to a slow method that requires two separate scans for 2D and
             3D, and only a sampling process.




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