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Volta Series Probe Head

Wafer Level Testing From 200µ

Increased Throughput, Reduced Test Time

Smiths Interconnect’s Volta Series Probe Head provides improved
efficiency in high reliability WLP, WLCSP and KGD testing.

■ Extremely short signal path (≤3.80mm) enables low and stable contact
resistance, high current carrying capacity and longer life cycle
■ Enhanced planarity allows increased site to site test parallelism

■ Reduced test set-up time, simple maintenance and field
replacement ensure lower cost of ownership

■ Allows sorted die test of all sites simultaneously
resulting in increased test yields in a shorter time

See you at TestConX 2020 Booth 47

smithsinterconnect.com