The Electronics Packaging Technology Conference EPTC 2025
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The 27th Electronics Packaging Technology Conference (EPTC2025) will take place from December 2, – December 5, 2025 in Singapore.
The Electronics Packaging Technology Conference (EPTC) is an international conference organized by the IEEE Singapore RS/EPS/EDS Joint Chapter and co-sponsored by the IEEE Electronics Packaging Society (EPS). Since its inauguration in 1997, EPTC has been established as a highly reputable, international electronics packaging conference and is the IEEE EPS flagship conference in the Asia and Pacific Region.
It will feature keynotes, technical sessions, invited talks, panels, workshops, exhibitions, and networking activities. Topics include modules, components, materials, equipment technology, assembly, reliability, interconnect design, device and systems packaging, heterogeneous integration, wafer-level packaging, flexible electronics, LED, IoT, 5G, emerging technologies, 2.5D/3D integration technology, smart manufacturing, automation, and AI.
The EPTC technical program committee, with more than 100 experts from diverse semiconductor packaging technology areas, is committed to creating an engaging technical program for the international packaging community. The technical program will be supplemented by an exhibition, which provides an opportunity for leading companies to exhibit their latest technologies and products. Last year there were more than 650 attendees. This year we will continue to have a 4-day program and expect more attendees.
Confirmed Keynote Talks
Rewiring Edge AI System Efficiency with Advanced Packaging.
Speaker: Dr: Pax Wang, Advanced Packaging Division Director, UMC Abstract: The rapid deployment of AI across both data centers and edge devices is driving unprecedented demand for high bandwidth, compute density, and energy efficiency. Edge AI applications, from autonomous vehicles to mobile, wearables and smart industrial systems, increasingly require localized inference capabilities, and therefore pushing packaging technologies to evolve beyond traditional boundaries. This presentation explores the key trends in advanced packaging, including the evolution of interposer technology, emerging edge use cases for hybrid bonding, and power delivery integration. With node scaling prohibitively expensive for the majority of edge use cases, hybrid bonding in particular will play a key role in enabling innovative package configurations with mature node processes. In addition to technical aspects, collaborative and integration-ready solutions will also be key in driving heterogeneous integration in the AI era.
Interconnect Horizons: Wafer and Panel Innovation and Industry Partnerships to Unlock AI’s Next Leap
Speaker: Audrey Charles, Senior Vice President of Corporate Strategy and Advanced Packaging; President of LAM Capital, LAM Research Abstract: As AI systems scale in complexity and capability, their demands for bandwidth, power efficiency, and heterogeneous integration are rapidly outpacing the capabilities of today’s packaging interconnect solutions. The industry faces a critical inflection point: wafer- and panel-level integration platforms must evolve to overcome mounting challenges in thermal management, signal integrity, and yield—especially as extra-large die and chiplet architectures become the norm. This keynote will explore the frontier of heterogeneous integration and its pivotal role in enabling the next generation of AI hardware. We will examine emerging interconnect architectures on both wafer and panel format designed to break through current limitations, with a focus on chiplet-photonics-memory co-packaging and the enabling materials and process innovations required to support them. Crucially, in the keynote, we shall advocate for an open, collaborative ecosystem—one that fosters healthy competition, accelerates co-innovation in materials science, and aligns around shared platforms to drive scalable progress. Only through collective industry action can we dismantle the “integration wall” and unlock AI’s next leap.
Call for Exhibitors/Sponsors
Details of the exhibition and sponsorship opportunities are available on the conference website.
