Dedicated HVM equipment platform boosts productivity and lowers cost-of-ownership of novel infrared laser release technology through silicon carrier wafers for 3D integration applications ST. FLORIAN,…
ASE introduces powerSiP™ for transformative power delivery that increases power efficiencies by 50% in AI and data center applications
SUNNYVALE, Calif., May 29, 2024 – Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced…
Toray develops hybrid bonding insulating resin that helps enhance yields and reliability in high-density semiconductor packaging
Tokyo, Japan, March 15, 2024 – Toray Industries, Inc., announced today that it has developed an insulating resin material for hybrid bonding (micro bonding). The…
Heterogeneous chiplet integration to make megachips
By Rabindra N. Das, Jason Plant, Alex Wynn, Matthew Ricci, Ryan Johnson, Matthew Stamplis, et al. [MIT Lincoln Laboratory] Chip Scale Review January • February…
Amkor Technology and GlobalFoundries cut ribbon on strategic cooperation in Portugal
Partnership to strengthen European automotive supply chain and expand services for global customers Tempe, AZ, USA – January 16, 2024 — Amkor Technology, Inc. (Nasdaq:…
Gel-Pak announces new Gel-Probe product line
Hayward, CA, USA – Gel-Pak, a Delphon company and a global leader in elastomer-based materials and protective carriers for the semiconductor, medical, and electronics industries,…
Large-size multi-layered fan-out RDL multi-chip module packaging
Large-size multi-layered fan-out RDL multi-chip module packaging By Nicholas Kao, Jay Li, Jackson Li, Yu-Po Wang[Siliconware Precision Industries Co., Ltd] This article was published in…
Sustaining Moore’s Law with graphene
Since the invention of metaloxide-semiconductor(MOS) integrated circuits in the early 1960s, the speed, capacity, and complexity of the chips have increased dramatically, roughly following Moore’s…