In response to growing customer demand, the Siemens Xcelerator as a Service portfolio will become available on Microsoft Azure, beginning with Siemens’ Teamcenter X software…
Heterogeneous chiplet integration to make megachips
By Rabindra N. Das, Jason Plant, Alex Wynn, Matthew Ricci, Ryan Johnson, Matthew Stamplis, et al. [MIT Lincoln Laboratory] Chip Scale Review January • February…
Amkor Technology and GlobalFoundries cut ribbon on strategic cooperation in Portugal
Partnership to strengthen European automotive supply chain and expand services for global customers Tempe, AZ, USA – January 16, 2024 — Amkor Technology, Inc. (Nasdaq:…
Large-size multi-layered fan-out RDL multi-chip module packaging
Large-size multi-layered fan-out RDL multi-chip module packaging By Nicholas Kao, Jay Li, Jackson Li, Yu-Po Wang[Siliconware Precision Industries Co., Ltd] This article was published in…
Sustaining Moore’s Law with graphene
Since the invention of metaloxide-semiconductor(MOS) integrated circuits in the early 1960s, the speed, capacity, and complexity of the chips have increased dramatically, roughly following Moore’s…