IMAPS Device Packaging Conference 2026 | March 2-5 in Phoenix, Arizona

The Most Comprehensive technical program and exhibition for microelectronics and Advanced Packaging

🎤 Overcoming Critical Challenges in Glass Core Substrates for Next-Generation Chiplet and CPO Applications – Yoshiki Takahashi (AGC Inc.)
🎤 Future of AI Hardware Enabled by Advanced Packaging – Raja Swaminathan (AMD)
🎤 Power Packaging for AI/Data Center from Grid to Core – Thorsten Meyer (Infineon)
🎤 Sandeep Razdan (NVIDIA)

 

 

 

 

WHY ATTEND

• Explore the latest emerging technologies and applications that are driving advancements in packaging
• Build partnerships with semiconductor packaging service providers, equipment suppliers, materials manufacturers, and government agencies
• Expand your knowledge through professional development courses and a robust 4-track technical program
• Engage with the advanced packaging industry’s top leaders, researchers, engineers and academia
• Experience unique networking opportunities that allow for meaningful conversations and connections

For additional information: https://imaps.org/page/device-packaging-conference