The leading event for Chiplet and Heterogeneous Integration Packaging (CHIP) technology … Addressing the challenges and opportunities for enabling broader adoption of chiplet architectures 

The program will cover the full flow: device/package architectural planning, packaging material & process technology selection, design & simulation, and device assembly and test.

As the world’s leading semiconductor companies continue to push the limits of process technology, the industry is experiencing a marked shift in device design and architectures to overcome the performance, economic, and time-to-market expectations faced by advanced semiconductor solution providers. CHIPcon is a conference focused on the opportunities for the expanded adoption of chiplet-based devices in not only data center applications, but also in the automotive, industrial, enterprise, and consumer/client markets. The conference will examine the technical and commercial challenges faced, and what is being done to overcome these to support the development of a vibrant and viable design and manufacturing ecosystem. The conference will present and examine a range of applications, user experiences, and the advanced design (DFx), simulation, packaging, test, and metrology technologies supporting this effort. 

For additional information: www.imaps.org/page/CHIPcon-2025