Businesses and consumers are adopting artificial intelligence (AI) at a rapid pace, placing enormous new demands on computing and communications. Next-generation data centers supporting upcoming AI applications will require massive new scale in high-performance computing (HPC) and high- bandwidth memory (HBM), as well as higher energy efficiency.

By David K. Lam, Kenneth P. MacWilliams [Multibeam Corporation]

This article was published in the May June 2024 issue of Chip Scale Review