Tokyo, Japan | Resonac Corporation | April 20, 2026 | Resonac Launches R&D Center for Next-Gen Semiconductor Package Technology under U.S.-Japanese Consortium “US-JOINT” Public and…
Siemens collaborates with TSMC to advance AI for semiconductor design
Plano, Texas, USA – April 22 2026 | Siemens collaborates with TSMC to advance AI for semiconductor design. Siemens collaborates with TSMC to advance AI-powered…
The 76th Electronics Packaging Technology Conference EPTC 2026
The 76th Electronics Packaging Technology Conference EPTC 2026. Bring your networking to the next level at ECTC! With technical sessions, panels, interactive presentations, a high…
MRSI Mycronic announces advanced high-speed 1µm die bonder MRSI-LEAP for ultra-high-volume manufacturing of AI optical module applications
MRSI Mycronic is proud to announce the launch of the MRSI-LEAP high-speed 1µm die bonder. This innovative equipment is designed for ultra-high-volume manufacturing of optical…
FAMES pilot line inaugurated after delivering first validated technical results
FAMES pilot line inaugurated after delivering first validated technical results New cleanroom Is a world-class facility that will host state-of-the-art 300mm semiconductor equipment Grenoble, France…