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reference mission profiles to cover most connectivity will develop from bare With the requirement of permanent
of these extended lifetime requirements connected infotainment, to a “car-to- accessibility, connectivity will be
is beneficial for both supplier and user anything” communication. There will one of the main drivers that increases
because this approach brings certain be a strong link to autonomous driving the operational time of packages
advantages compared to standardized (and ECUs) for automotive
extended stress test conditions: applications. For example,
software updates can be done
• Standardized mission profiles are during parking, using a wireless
usable in established processes local area network.
(today used for customer specific
mission profiles); Summary
• Failure mode specific test evaluation The three megatrends: 1)
b e c o m e s p o s s i b l e (s o f i e l d autonomous driving, 2) eMobility,
application-relevant qualification and 3) connectivity, are coming
failures can be discarded on a solid with specific requirements that will
basis); need adjustments for developing
• It allows the use of a knowledge- and enabling new, effective
ba s e d q u a l i f ic at ion u si ng a packaging solutions. Advanced
structured generic data approach packages for miniaturization,
(i.e., a n a d apt ed robu st ne ss integration for fulfillment of safety
validation approach). This may requirements, and redundancy
improve time to market without any and advanced heat dissipation
compromises on reliability. Figure 8: Requirements for connected cars [3]. options are key for f ut u re
automotive solutions. For these
In this section, the topic was analyzed that will require permanent accessibility future automotive package designs, it will
only based on an exemplary temperature of the car over the air for requests from be essential to have tools and methods in
mission profile. For future automotive the customer or the backbone. place to deal with thermal cycling profiles,
package designs, it will be essential Data security will play a major role in temperature-humidity profiles, and profiles
to have tools and methods in place this area. Basic security considerations based on other stressors, as well depending
to deal with thermal cycling profiles, have to be implemented. A secure on- on the applications. Security and increased
temperature-humidity profiles, and board communication, undisrupted reliability will also play a major role in
profiles based on other stressors, as well car-2-cloud, car-2-infrastructure, and connectivity solutions for automotive
as those that depend on the application. car-2-car communication has to be applications. Packaging technology will
provided. A basic protection of the finally make the difference.
Connectivity single ECUs is important, as well as a
Despite all the changes brought firewall and gateway, and a separate Acknowledgement
about by the use of semiconductors, infotainment protection capability. Originally published at the International
a car remains a car and comfort and From a technology point of view, Device Packaging Conference, Fountain
safety remain the key expectations of advanced packaging, such as SiP along Hills, Arizona, March 2020.
the users. High-end cars will continue with small node size chip technology,
to be the early adopters of high-end will be used. Components that have References
comfort and safety features, but those originally been designed for consumer 1. https://de.wikipedia.org/wiki/SAE_
features will trickle down to mid- and electronics, will make their way into the J3016
low-end cars over time. automotive sector. One example is the 2. https://www.infineon.com/cms/en/
Connectivity will enable a vehicle to embedded wafer-level ball grid array applications/automotive/chassis-
access the internet and to communicate (eWLB) technology, which had originally safety-and-adas/electric-power-
with smart devices, as well as other been developed for wireless applications. steering-eps/
cars, and road-based infrastructures will It has found its way into the automotive 3. K . Ko n r a d , “ T h e i m p a c t of
provide “swarm intelligence” thereby sector for radar applications—with automated, driverless cars on
enabling the collection of real-time data modifications to serve the increased semiconductors – an overview,” IS-
from multiple sources (Figure 8). Such reliability requirements. Test Workshop, May 2019.

Biographies
Thorsten Meyer is Lead Principal Engineer at Infineon Technologies AG, Regensburg, Germany. He holds a
Diploma in Production Engineering. His focus lies in the development of new package concepts and he is the
author of multiple publications and holds more than 150 patents and patent applications in the area of advanced
packaging. Email Thorsten.Meyer2@infineon.com
Ulrich Abelein is Principal Engineer at Infineon Technologies in Neubiberg, Germany. He received degrees
in Electrical Engineering from the Technical U. of Munich, 2003 and in economics from the U. of Hagen.

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