Page 16 - ChipScale_Sep-Oct_2020-digital

Automotive packaging trends: challenges and solutions

By Thorsten Meyer, Ulrich Abelein, EungSan Cho, Bernhard Knott, Stefan Macheiner [Infineon Technologies AG]

E le c t r o n i c c o m p o n e n t s to driving and parking, which are status and thermal/electrical requirements.

entered t he automot ive
eMobility requires additional operating
area in the 1950s and 1960s quo for traditional combustion engines, As complexity increases, there will be
no single package solution that fulfills
with the introduction of semiconductor states like on-grid parking, vehicle- all needs. System integration with
transistors in car radios and power diodes preconditioning (for the battery, as well technology and packaging features
in alternators. Since then, electronics as for driver comfort, e.g., cabin heating) from consumer electronics that have
have spread into all relevant areas of and charging. The inevitably increasing been adapted and qualified for the harsh
automotive transportation. Today, up to operating times and the need for highly- conditions of automotive applications will
80% of all innovations in a modern car efficient power electronics (e.g., SiC) with therefore be one approach for future uses.
are supported by electronics that address rising operational temperatures up to Each of these megatrends is discussed in
applications in all areas of motor and 200°C will drive innovation, especially in the sections below.
chassis functions, comfort, security, and the materials area.
safety. The majority of these innovations By adding sensors and microelectronic Autonomous driving
in automotive applications support three components to eMobility systems, Autonomous driving means fully-
megatrends: 1) autonomous driving, 2) the heterogeneity and complexity is automated driving—the people in
electro-mobility, and 3) connectivity. increasing without losing sight of the the car become passengers. How will
A ut o no m ou s d r i v i n g . T h e need for fast time to market and low semiconductor packaging be affected by
implementation of autonomous driving is cost. These requirements will require this development? The answer is that,
divided into five different levels according highly innovative solutions in chip because all tasks related to driving a car,
to the Society of Automotive Engineers design, technology, and especially in such as accelerating, braking, or steering
(SAE) [1]. While in level 1, the driver is packaging. Novel operating states, e.g., will be taken over by the car itself,
only supported by some assistance systems for vehicle charging, are coming with the amount of sensors, actuators and
(e.g., anti-lock braking system [ABS], etc.) the applications developed within this controllers will see a dramatic increase.
during the car’s operation. In the highest framework. The results are significantly In addition, the car needs to recognize
level 5, however, the driver will become extended lifetime requirements. The situations and act accordingly. Control
a passenger in a fully-automated vehicle. AEC-Q100/101 stress test conditions are units with increased computing power
The higher the automation level, the more no longer suitable to qualify a package are needed to deal with this “big data”
support is needed from advanced driving according to these mission profiles. requirement. Furthermore, safety critical
assistance systems (ADAS). Therefore, Connectivity. Connectivity will applications like steering or braking need
ADAS is generating a strong demand for develop from connected infotainment to to be redundant to ensure the highest
high-performance computing power, as well “car-to-x” communication. There will be safety level.
as various sensor technologies, preferably in a strong link to autonomous driving as As a consequence of the above
complex system in package (SiP) solutions well, e.g., the use of swarm intelligence. considerations, autonomous driving
with multiple integrated components. Software updates have to be possible will not only increase the amount
On the one hand, driverless operation “over the air,” therefore, the vehicle has of semiconductor components, and
re q u i re s h ig h l y- rel i a bl e , h ig h - to be permanently accessible for any therefore, the number and different kinds
performance packaging solutions to cope requests from the backbone/customer. of semiconductor packages, but will also
with the expected use time extension. On Connectivity will be one of the main demand challenging requirements with
the other hand, the rising gap between drivers that increases the operational respect to power density, heat dissipation,
ambient and junction temperature time of automotive packages (and ECUs), and current capability—all combined
requirements (because of enhanced mainly SiP at small nodes in this area. in miniaturized packages that meet the
self-heating), means that the exposed A l l t h r e e m e g a t r e n d s i n t h e highest automotive reliability standards.
mounting locations (e.g., for sensors) automotive arena require increased Examples of automotive package
with direct contact to corrosives demand integration of components in order to developments that support upcoming
highly-reliable, top-quality components. fulfill the performance and dimension requirements for autonomous driving are
Electro-mobility (eMobility). Electro- requirements. Packages have to fulfill as follows:
mobility will provide a big step towards increased reliability requirements caused Miniaturization. Miniaturization
the vision of zero emissions. In addition by the extension of operational times involves both flip-chip attach on lead

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