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Volta Series Probe Head

                                                            Wafer Level Testing From 200µ






          Increased Throughput, Reduced Test Time


          Smiths Interconnect’s Volta Series Probe Head provides improved
          efficiency in high reliability WLP, WLCSP and KGD testing.


          ■ Extremely short signal path (≤3.80mm) enables low and stable contact
             resistance, high current carrying capacity and longer life cycle

          ■ Enhanced planarity allows increased site to site test parallelism

          ■ Reduced test set-up time, simple maintenance and field
             replacement ensure lower cost of ownership

          ■ Allows sorted die test of all sites simultaneously
             resulting in increased test yields in a shorter time




 Visit us at IWLPC Virtual Event October 13th-14th 2020




          smithsinterconnect.com
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