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filling with minor adjustments of the VMS.
The physical properties, tensile strength
and elongation of these copper-plated
deposits pass IPC class III specification
and have low internal stress as-plated
and after annealing, thereby providing
LEADERS IN a reliable deposit that will withstand the
stresses of assembly and device usage.
MICRO DISPENSING References

TECHNOLOGY 1. H. Akahoshi, M. Kawamoto, T.
Itabashi, O. Miura, A. Takahashi,
S. Kobayashi, “Fine-line circuit
SMALL REPEATABLE VOLUMES manufacturing technology with
ARE A CHALLENGE, BUT NOT electroless copper plating,” IEEE
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18, pp. 127-135, 1995.
2. Y-H. Chen, S-L. Cheng, D-C. Hu, T-J.
Tseng, “L/S ≤5/5μm line embedded
TO DO IT WELL, organic substrate manufacturing for
WE PROVIDE THREE THINGS: 2.1D/2.5D SiP application,” IMAPS,
Nov. 2015.
3. C. Chen, M. Lin, G. Liao, Y. Ding,
W. Cheng, “Balanced embedded trace
substrate design for warpage control,”
Dispensing Expertise in a variety of microelectronic IEEE Elec. and Comp. Tech. Conf.,
packaging applications. May 26–29, 2015, pp. 193–199.
4. Y. Li, D. Goyal, 3D Microelectronic
Feasibility Testing & Process Verification based Packaging From Fundamentals to
on years of product engineering, material flow testing Applications, Springer, Jan. 20, 2017 -
and software control. Technology.
5. S. Dharmarathna, et al., “High throw
Product Development for patented valves, DC acid copper formulation for
dispensing cartridges, needles, and accessories. vertical continuous electroplating
processes,” IPC APEX Expo 2017,
San Diego, CA, Feb. 14-16.
6. Y. Zhang, G. Ding, P. Cheng, H.
Wang, “Numerical simulation and
experimental verification of additive
Our Micro Dispensing product line is proven and trusted by distribution in through-silicon via
manufacturers in semiconductor, electronics assembly, medical during copper filling process,” Jour.
device and electro-mechanical assembly the world over. of The Electrochemical Soc., 162 (1)
www.dltechnology.com. D62-D67 (2015).

216 River Street, Haverhill, MA 01832 • P: 978.374.6451 • F: 978.372.4889 • info@dltechnology.com

Biographies
Kesheng Feng is Director of Research, Metallization Technology at MacDermid Alpha Electronics Solutions,
Waterbury, CT, USA. He has 22 years of experience in the PCB industry with MacDermid Alpha with a
primary focus on IC substrates, HDI, and primary metallization techniques. He holds 12 US patents, has
authored more than 25 technical articles, and holds a PhD in Organic Chemistry from Nankai U. in China.
Email Kesheng.Feng@MacDermidAlpha.com
Kwangsuk Kim (Leslie Kim) is Business Manager, IC Substrates and Electronics Materials at MacDermid
Alpha Electronics Solutions, Bundang-Gu Sungnam-City, Kyungki-Do, Korea. In his 21 years with MacDermid
Alpha he has dedicated himself to the development and application of new processes and technologies in high technology PCB,
IC substrate, LED and molded interconnects. He holds a Bachelor’s degree in Applied Chemistry and a Master’s in Business
Administration, both from Anjou U. in Korea.

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