Page 27 - ChipScale_May-June_2020-digital

Laser Assisted Bonding

The LAPLACE-system provides an integrated solution
for flip chip assembly, the laser reflow will be done
during the placement - all in one step. The laser assisted
assembly can be applied for soldering, ACF and NCP
interconnections. The optional dispensing unit in the flip
chip assembly platform allows a maximal flexibility for
flux, solder paste and/or ACF, NCP dispensation.

New Applications

Selective Chip Rework

• Selective removal of bad die
• In-situ replacement & reflow
• Cost saving for high density fan-out packaging

3D Packaging

• In-situ die placement & reflow
• Lowest thermal & mechanical stress
• High chip stack uniformity

3.5D Multilayer Die Stacking

• Horizontal & vertical chip assembly
• No requirement for TSV structures
• Simplification of complex package design

ISO 9001 www.pactech.com
IATF 16949
ISO 14001 sales@pactech.com
ISO 50001