Page 33 - Chip Scale Review_March-April_2024-digital

bandwidth requirement of the chiplets. the Cu traces was observed along the
Figure 7a shows the 3µm diameter stitching line boundary. The stepper
contact via openings patterned in a tool mask align ment accuracy is
photodielectric film for connecting maintained to below 0.2µm to ensure
the different level of Cu RDL, while good stitching between the mask field.
Figure 7b shows the landing pads and Chiplet assembly, wafer-level
Cu traces processed over the contact m o l d i n g a n d R D L i n t e r p o s e r
vias. Figure 8 shows the fine-pitch package assembly. Figures 9a-b
Cu traces fabricated at the stitching show the optical images of the chiplets
section (blue dash line) between the assembled onto the RDL stack on the
two mask fields. No discontinuity in carrier wafer and after wafer-level

BALL PLACEMENT & LASER SOLDERING

3D-Soldering Solder Stacking Wire Soldering BGA Soldering

Figure 6: A segment of the high-density 2µm L/S Cu
RDL traces at different magnifications.

Pre-Soldering of Lid Sealing for Flex to Chip Through Hole
SMD Connector Connectors & Soldering Soldering
Elements IR-Sensors

LASER ASSISTED BONDING (LAB, LCB, LAR)

3D Multi Layer Optoelectronic CPU on Interposer SMD Capacitor
Stacked Packaging Device Assembly Assembly Assembly
SOLDER & CHIP REPAIR

BGA Interconnects of BGA Package Assembly Flex to Flex
Rework Camera Module onto Substrate Seperation

WE MANUFACTURE

EQUIPMENT FOR

YOUR NEEDS

Figure 7: Contact vias for connecting the different Cu
RDL: a) 3µm diameter contact via openings developed
in a photodielectric film; and b) Cu traces and landing
pad processed over the contact vias.

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