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Figure 4 shows the high-density multi-
junction VCSEL chip epoxy COB die
bonding results.
Summary
Based on our discussions about
automotive LiDAR assembly requirements
and technical trends, and the experiments
on laser die assembly using the MRSI-H-
LD 1.5µm high-accuracy die bonder, the
following conclusions can be drawn:

1. The automotive LiDAR photonics
device assembly process is similar
to the process used for optical
transceivers but has higher reliability
requirements.
Figure 3: 905nm EEL high power laser die bonding results by eutectic and epoxy processes. 2. High-flexibility, high-reliability,
high-accuracy, and high-speed
process equipment is the best solution
to support automotive LiDAR high-
mix/high-volume manufacturing.

Acknowledgment
The authors are grateful to Lumentum
for its support in providing laser samples
and assembly guidance.

References
1. L. Zhou, “Flexible high-volume die
bonding solution targets modern
photonics manufacturing,” Laser
Focus World, July 2020.
2. P. E. Ross, “Aeva unveils Lidar on a
chip: Aeva says its high-performance
lidar will sell for less than US $500;
VW is buying it,” IEEE Spectrum,
Dec. 11, 2019.
3. “Practical solutions for enhancing
autonomous vehicle safety using
Figure 4: High-density multi-junction VCSEL chips epoxy COB bonding results. L i DA R- b a s e d 3D s e n s i n g ,”
Lumentum white paper, 2020.
photonics device manufacturers use the die bonding and had the following results:
epoxy chip on board (COB) process for 1) The X/Y post-bonding accuracy is 4. “Valeo Scala Laser Scanner Report,”
automotive LiDAR applications. We 1.9μm@3σ and 1.3μm@3σ, respectively, System Plus Consulting 2019.
completed experiments for the epoxy COB and the angle accuracy is 0.17°@3σ. 5. “LiDAR for Automotive 2023
©
Report,” Yole Intelligence 2023.

Biographies
Limin Zhou is Senior Director of Strategic Marketing at MRSI Systems, Mycronic Group, and General
Manager of MRSI Automation (Shenzhen) Co., Ltd., Shenzhen, China. Prior to joining the company in
2019, he was Senior R&D Director at NeoPhotonics, China, NPI & Product Engineering Director in Oclaro
Asia, and NPI Operation Director in both JDSU and SAMN-SCI (China). He also worked at Sebit as co-
founder of a start-up laser company. His career began at Chartered Semiconductor (Singapore). He has a
PhD in Automation from Xi’an Jiaotong U. (XJTU). Email limin.zhou@mycronic.com

Avy Yi is Senior Manager of Application and Service Engineering at MRSI, a part of Mycronic Group, Shenzhen, China. He
joined MRSI 20 years ago and has been serving various application customers in China and other regions in Asia, familiar with the
packaging process of various devices and modules. As a senior assembly application expert at MRSI, he has a deep understanding
and practical experience in highly reliable and high-precision die bonding processes. He has a BE in Mechanical Engineering.

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