Page 28 - Chip Scale Review_November-December_2023-digital

Figure 1: Automotive LiDAR package design trends.
components to module-level integration, assembly accuracy and other requirements attached with an epoxy process, and an
and even chip-level integration (see are also similar. Depending on the optical lens with ultraviolet (UV) epoxy
Figure 1). The market is trending different laser package designs, from 5μm plus in situ curing.
towards highly-integrated, thinner and to 0.5μm is the typical high-accuracy According to Yole Intelligence [5],
cheaper products [1-4]. Consequently, requirement for laser die; other parts, “The LiDAR market for passenger cars
higher accuracy assembly is required however, may have less critical accuracy (PC) and light commercial vehicle (LCV)
to manufacture the photonics devices. requirements. In general, most edge- and robotaxis is expected to reach $4.5B
Automotive LiDAR has a similar emitting laser dies are attached with a in 2028 with a 55% CAGR from 2023.”
photonics device assembly process to eutectic process (some may use an epoxy So the LiDAR volume will ramp up
that of the optical transceivers, and the process); VCSEL laser dies are usually very fast. In the long run, technological
choices will have to be made to be
aligned with mass production, low cost,
and high performance, and pricing
pressure will increase. Lower cost and
high-reliability mass production will be
essential. Therefore, the photonics devices
assembly solution for automotive LiDAR
must have higher efficiency for low-cost
volume manufacturing. To summarize,
the photonics assembly requirements for
automotive LiDAR are high reliability,
high flexibility, high accuracy, high speed
and fully automated.

Solutions for photonics die
assembly
Similar to optical transceivers, higher
flexibility, higher reliability, higher
accuracy, and higher speed (efficiency) are
the solutions to address the challenges of
volume manufacturing in the automotive
LiDAR industry. We have provided
solutions to the industry challenges with
our MRSI-H-LD die bonder (Figure 2).
Our bonder has an accuracy of
±1.5µm@3σ. Higher accuracy is also
available as an option (±1µm @3σ). This
bonder has a very stable gantry head and
is equipped with a patented tool changer
that does not require recalibration after the
tool change. The tool changer is equipped
with a 12-tip turret to achieve “on-the-

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